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TMM41257AT-10

Description
IC,DRAM,NIBBLE MODE,256KX1,MOS,LDCC,18PIN,PLASTIC
Categorystorage    storage   
File Size945KB,16 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TMM41257AT-10 Overview

IC,DRAM,NIBBLE MODE,256KX1,MOS,LDCC,18PIN,PLASTIC

TMM41257AT-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid101067752
package instructionQCCJ, LDCC18,.33X.53
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
I/O typeSEPARATE
JESD-30 codeR-PQCC-J18
JESD-609 codee0
memory density262144 bit
Memory IC TypeNIBBLE MODE DRAM
memory width1
Number of terminals18
word count262144 words
character code256000
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC18,.33X.53
Package shapeRECTANGULAR
Package formCHIP CARRIER
power supply5 V
Certification statusNot Qualified
refresh cycle256
Maximum slew rate0.08 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD

TMM41257AT-10 Related Products

TMM41257AT-10 TMM41257AT-12 TMM41257AZ-10 TMM41257AZ-12 TMM41257AZ-15
Description IC,DRAM,NIBBLE MODE,256KX1,MOS,LDCC,18PIN,PLASTIC IC,DRAM,NIBBLE MODE,256KX1,MOS,LDCC,18PIN,PLASTIC IC,DRAM,NIBBLE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC IC,DRAM,NIBBLE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC IC,DRAM,NIBBLE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Objectid 101067752 101067759 101067790 101067795 101067804
package instruction QCCJ, LDCC18,.33X.53 QCCJ, LDCC18,.33X.53 ZIP, ZIP16,.1 ZIP, ZIP16,.1 ZIP, ZIP16,.1
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 120 ns 100 ns 120 ns 150 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PQCC-J18 R-PQCC-J18 R-PZIP-T16 R-PZIP-T16 R-PZIP-T16
JESD-609 code e0 e0 e0 e0 e0
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM
memory width 1 1 1 1 1
Number of terminals 18 18 16 16 16
word count 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX1 256KX1 256KX1 256KX1 256KX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ ZIP ZIP ZIP
Encapsulate equivalent code LDCC18,.33X.53 LDCC18,.33X.53 ZIP16,.1 ZIP16,.1 ZIP16,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 256 256 256 256 256
Maximum slew rate 0.08 mA 0.072 mA 0.08 mA 0.072 mA 0.065 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO NO
technology MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD ZIG-ZAG ZIG-ZAG ZIG-ZAG
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