TLV2264AIN datasheet, PDF - EEWORLD Datasheet

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TLV2264AIN: DescriptionAdvanced LinCMOS™ Rail-To-Rail Quad Operational Amplifier 14-PDIP -40 to 125; CategoryAnalog mixed-signal IC Amplifier circuit; File Size814KB，51 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TLV2264AIN Overview

Advanced LinCMOS™ Rail-To-Rail Quad Operational Amplifier 14-PDIP -40 to 125

TLV2264AIN Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP14,.3
Contacts	14
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.00006 µA
Maximum bias current (IIB) at 25C	0.00006 µA
Minimum Common Mode Rejection Ratio	70 dB
Nominal Common Mode Rejection Ratio	83 dB
frequency compensation	YES
Maximum input offset current (IIO)	0.00006 µA
Maximum input offset voltage	950 µV
JESD-30 code	R-PDIP-T14
JESD-609 code	e4
length	19.305 mm
low-bias	YES
low-dissonance	NO
micropower	YES
Number of functions	4
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TUBE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power	NO
power supply	+-1.35/+-4/2.7/8 V
Programmable power	NO
Certification status	Not Qualified
Maximum seat height	5.08 mm
minimum slew rate	0.3 V/us
Nominal slew rate	0.55 V/us
Maximum slew rate	0.25 mA
Supply voltage upper limit	16 V
Nominal supply voltage (Vsup)	3 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	710 kHz
Minimum voltage gain	55000
broadband	NO
width	7.62 mm

TLV2264AIN Related Products

	TLV2264AIN	TLV2262AIP	TLV2264ID	TLV2262AID
Description	Advanced LinCMOS™ Rail-To-Rail Quad Operational Amplifier 14-PDIP -40 to 125	Advanced LinCMOS™ Rail-To-Rail Dual Operational Amplifier 8-PDIP -40 to 125	Quad Rail-To-Rail Low-Voltage Low-Power Operational Amplifier 14-SOIC -40 to 125	Advanced LinCMOS™ Rail-To-Rail Dual Operational Amplifier 8-SOIC -40 to 125
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	DIP	DIP	SOIC	SOIC
package instruction	DIP, DIP14,.3	DIP-8	SOP, SOP14,.25	SOIC-8
Contacts	14	8	14	8
Reach Compliance Code	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.00006 µA	0.0008 µA	0.00006 µA	0.0008 µA
Maximum bias current (IIB) at 25C	0.00006 µA	0.00006 µA	0.00006 µA	0.00006 µA
Minimum Common Mode Rejection Ratio	70 dB	70 dB	70 dB	70 dB
Nominal Common Mode Rejection Ratio	83 dB	83 dB	83 dB	83 dB
frequency compensation	YES	YES	YES	YES
Maximum input offset current (IIO)	0.00006 µA	0.00006 µA	0.00006 µA	0.00006 µA
Maximum input offset voltage	950 µV	950 µV	2500 µV	950 µV
JESD-30 code	R-PDIP-T14	R-PDIP-T8	R-PDSO-G14	R-PDSO-G8
JESD-609 code	e4	e4	e4	e4
length	19.305 mm	9.59 mm	8.65 mm	4.9 mm
low-bias	YES	YES	YES	YES
low-dissonance	NO	NO	NO	NO
micropower	YES	YES	YES	YES
Number of functions	4	2	4	2
Number of terminals	14	8	14	8
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP14,.3	DIP8,.3	SOP14,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
method of packing	TUBE	TUBE	TUBE	TUBE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	260	260
power	NO	NO	NO	NO
power supply	+-1.35/+-4/2.7/8 V	+-1.35/+-4/2.7/8 V	+-1.35/+-4/2.7/8 V	+-1.35/+-4/2.7/8 V
Programmable power	NO	NO	NO	NO
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	1.75 mm	1.75 mm
minimum slew rate	0.3 V/us	0.3 V/us	0.3 V/us	0.3 V/us
Nominal slew rate	0.55 V/us	0.55 V/us	0.55 V/us	0.55 V/us
Maximum slew rate	0.25 mA	0.5 mA	0.25 mA	0.5 mA
Supply voltage upper limit	16 V	16 V	16 V	16 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	710 kHz	710 kHz	710 kHz	710 kHz
Minimum voltage gain	55000	55000	55000	55000
broadband	NO	NO	NO	NO
width	7.62 mm	7.62 mm	3.9 mm	3.9 mm

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