Data Sheet
Rev. 1.11 / June 2011
ZSSC3008
Sensor Signal Conditioner with Diagnostics
ZSSC3008
Sensor Signal Conditioner with Diagnostics
Brief Description
The ZSSC3008 is a sensor signal conditioner IC that
is adjustable to nearly all piezo-resistive bridge sen-
sors. Measured and corrected bridge values are pro-
vided at the SIG™ pin, which can be configured as
an analog voltage output or as a one-wire serial dig-
ital output.
The digital one-wire interface (OWI) can be used for
a simple PC-controlled calibration procedure to pro-
gram a set of calibration coefficients into an on-chip
EEPROM. The calibrated ZSSC3008 and a specific
sensor are mated digitally: fast, precise, and without
the cost overhead associated with trimming by exter-
nal devices or laser. Integrated diagnostics functions
make the ZSSC3008 particularly well-suited for auto-
motive applications.*
Benefits
PC-controlled configuration and calibration via
one-wire interface – simple, low cost
High accuracy (±0.1% FSO @ -25 to 85°C;
±0.25% FSO @ -40 to 125°C)
Single-pass calibration – quick and precise
Available Support
Development Kit available
Multi-Unit Calibrator Kit available
Support for industrial mass calibration available
Quick circuit customization possible for large
production volumes
Physical Characteristics
Features
Wide operation temperature: –40°C to +125°C
Supply voltage 2.7 to 5.5V; with external JFET,
5.5 to 30V
Small SOP8 package
Digital compensation of sensor offset, sensitivity,
and non-linearity
Programmable analog gain and digital gain;
accommodates bridges with spans < 1mV/V
and high offset
Many diagnostic features on chip (e.g., EEPROM
signature, bridge connection checks, bridge short
detection, power loss detection)
Independently programmable high and low
clipping levels
24-bit customer ID field for module traceability
Output options: rail-to-rail ratiometric analog
voltage (12-bit resolution), absolute analog
voltage, digital one-wire interface
Fast power-up to data out response; output
available 5ms after power-up
Current consumption depends on programmed
sample rate: 1mA down to 250A (typical)
Fast response time: 1ms (typical)
High voltage protection up to 30V with
external JFET
ZSSC3008 Application Circuit
V
supply
+2.7 to +5.5 V
VDD
SIG™
OUT/OWI
ZSSC3008
VBP
Vgate
VBN
VSS
0.1
F
Ground
* Not AEC-Q100-qualified.
© 2011
Zentrum Mikroelektronik Dresden AG
— Rev. 1.11
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
The information furnished in this publication is subject to changes without notice.
ZSSC3008
Sensor Signal Conditioner with Diagnostics
ZSSC3008 Block Diagram
0.1 F
JFET
1
(Optional if supply is 2.7 to 5.5 V)
S
D
5.5 V to 30 V
V
SUPPLY
Highly Versatile Applications
in Many Markets Including
Industrial
Building Automation
Office Automation
White Goods
Automotive *
Portable Devices
Your Innovative Designs
V
DD
(2.7 to 5.5 V)
Vgate
Sensor
Diagnostics
VBP
VBN
VDD
Regulator
ZSSC3008
12-Bit
DAC
A
INMUX
PREAMP
EEPROM
with Charge
Pump
_
D
ZACwire
TM
Interface
SIG
TM
0 V to 1 V
Ratiometric
Rail-to-Rail
OWI/ZACwire
TM
+
14-Bit ADC
OUTBUF1
(Optional)
Bsink
Power Save
POR/Oscillator
Digital
Core
Power Lost
Diagnostic
Analog Block
* Not AEC-Q100-qualified.
Digital Block
VSS
Rail-to-Rail Ratiometric Voltage Output Applications
Absolute Analog Voltage Output Applications
Product Ordering Codes
(Please contact ZMDI Sales for additional options.)
Sales Code
ZSSC3008AA2R
ZSSC3008AA2T
ZSSC3008KIT
Description
ZSSC3008 SOP8 (150 mil) — Temperature range: -40°C to +125°C
ZSSC3008 SOP8 (150 mil) — Temperature range: -40°C to +125°C
ZSSC3008 SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement Board,
Evaluation Software, USB Cable, 5 IC Samples
Tube
Kit
Package
Tape and Reel
Sales and Further Information
Zentrum Mikroelektronik
Dresden AG (ZMD AG)
Grenzstrasse 28
01109 Dresden
Germany
Phone
Fax
+49 (0)351.8822.7.772
+49(0)351.8822.87.772
www.zmdi.com
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
Phone
Fax
+81.3.6895.7410
+81.3.6895.7301
SSC@zmdi.com
ZMD Far East, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone
Fax
+886.2.2377.8189
+886.2.2377.8199
ZMD America, Inc.
8413 Excelsior Drive
Suite 200
Madison, WI 53717
USA
Phone
Fax
+1 (608) 829-1987
+1 (631) 549-2882
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG
(ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under
no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever
arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any
other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, perfor-
mance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise.
© 2011
Zentrum Mikroelektronik Dresden
AG — Rev.1.11
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
ZSSC3008
Sensor Signal Conditioner with Diagnostics
Contents
1
Electrical Characteristics ......................................................................................................8
1.1. Absolute Maximum Ratings ............................................................................................8
1.2. Recommended Operating Conditions .............................................................................8
1.3. Electrical Parameters ......................................................................................................9
1.4. Analog Input versus Output Resolution.........................................................................11
Circuit Description ..............................................................................................................14
2.1. Signal Flow and Block Diagram ....................................................................................14
2.2. Analog Front End ..........................................................................................................15
2.2.1. Bridge Supply ..........................................................................................................15
2.2.2. PREAMP Block........................................................................................................15
2.2.3. Analog-to-Digital Converter (ADC)...........................................................................15
2.3. Digital Signal Processor ................................................................................................16
2.3.1. EEPROM .................................................................................................................16
2.3.2. One-Wire Interface - ZACwire™ ..............................................................................17
2.4. Output Stage.................................................................................................................17
2.4.1. Digital to Analog Converter (Output DAC) with Programmable Clipping Limits .......17
2.4.2. Output Buffer ...........................................................................................................18
2.4.3. Voltage Reference Block .........................................................................................18
2.5. Clock Generator / Power-On Reset (CLKPOR) ............................................................19
2.5.1. Trimming the Oscillator............................................................................................20
2.6. Diagnostic Features ......................................................................................................20
2.6.1. EEPROM Integrity ...................................................................................................21
2.6.2. Sensor Connection Check .......................................................................................21
2.6.3. Sensor Short Check.................................................................................................21
2.6.4. Power Loss Detection..............................................................................................22
Functional Description ........................................................................................................22
3.1. General Working Mode .................................................................................................22
3.2. ZACwire™ Communication Interface ............................................................................24
3.2.1. Properties and Parameters......................................................................................24
3.2.2. Bit Encoding ............................................................................................................24
© 2011 Zentrum Mikroelektronik Dresden AG — Rev. 1.11
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
2
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Data Sheet
June 14, 2011
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ZSSC3008
Sensor Signal Conditioner with Diagnostics
3.2.3. Write Operation from Master to ZSSC3008 .............................................................25
3.2.4. ZSSC3008 Read Operations ...................................................................................25
3.2.5. High Level Protocol..................................................................................................28
3.3. Command/Data Bytes Encoding ...................................................................................29
3.4. Calibration Sequence....................................................................................................30
3.5. EEPROM Bits ...............................................................................................................32
3.6. Calibration Math............................................................................................................35
3.6.1. Correction Coefficients ............................................................................................35
3.6.2. Interpretation of Binary Numbers for Correction Coefficients...................................35
3.7. Reading EEPROM Contents.........................................................................................37
4
Application Circuit Examples ..............................................................................................38
4.1. Three-Wire Rail-to-Rail Ratiometric Output...................................................................38
4.2. Absolute Analog Voltage Output ...................................................................................39
4.3. Three-Wire Ratiometric Output with Over-Voltage Protection.......................................40
4.4. Digital Output ................................................................................................................40
4.5. Output Resistor/Capacitor Limits ..................................................................................40
EEPROM Restoration.........................................................................................................41
5.1. Default EEPROM Contents...........................................................................................41
5.1.1. Osc_Trim .................................................................................................................41
5.1.2. 1V_Trim/JFET_Trim ................................................................................................41
5.2. EEPROM Restoration Procedure..................................................................................41
Pin Configuration and Package ..........................................................................................43
ESD/Latch-Up-Protection ...................................................................................................44
Test ....................................................................................................................................44
Quality and Reliability .........................................................................................................44
5
6
7
8
9
10 Customization.....................................................................................................................44
11 Product Ordering Codes .....................................................................................................44
12 Related Documents ............................................................................................................45
13 Definitions of Acronyms ......................................................................................................45
14 Document Revision History ................................................................................................46
Data Sheet
June 14, 2011
© 2011 Zentrum Mikroelektronik Dresden AG — Rev. 1.11
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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