M
PL
IA
N
Features
■
Available in E6 series
■
Unit height of 4.8 mm
■
Current up to 7.8 A
Applications
■
Input/output of DC/DC converters
■
Power supplies for:
*R
oH
S
CO
T
330
■
RoHS compliant*
•
•
•
•
Portable communication equipment
Camcorders
LCD TVs
Car radios
SRU1048 Series - Shielded SMD Power Inductors
Electrical Specifications
Bourns
Part Number
Inductance
@ 100 KHz
Tol.
L (µH)
(%)
Q
(Ref.)
Test
Freq.
(MHz)
SRF
Typ.
(MHz)
RDC
(mΩ)
I rms
Max.
(A)
I sat
Typ.
(A)
General Specifications
Test Voltage .......................................1 V
Reflow Soldering .. 230 °C, 50 sec. max.
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
............................. +260 °C for 10 sec.
Materials
Core ....................Ferrite DR and RI core
Wire ............................Enameled copper
Terminal ....................................Ag/Ni/Sn
Rated Current
...................Ind. drop 35 % typ. at Isat
Temperature Rise
.....................30 °C max. at rated Irms
Packaging .................... 600 pcs. per reel
Product Dimensions
10.0 ± 0.3
(.394 ± .012)
**K-
Factor
SRU1048-R80Y
SRU1048-1R5Y
SRU1048-2R2Y
SRU1048-3R0Y
SRU1048-4R7Y
SRU1048-6R8Y
SRU1048-8R2Y
SRU1048-100Y
SRU1048-1R2Y
SRU1048-150Y
SRU1048-220Y
SRU1048-330Y
SRU1048-470Y
SRU1048-560Y
SRU1048-680Y
SRU1048-820Y
SRU1048-101Y
SRU1048-151Y
SRU1048-221Y
SRU1048-331Y
SRU1048-561Y
0.8
1.5
2.2
3.0
4.7
6.8
8.2
10.0
12.0
15.0
22.0
33.0
47.0
56.0
68.0
82.0
100.0
150.0
220.0
330.0
560.0
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
8
14
14
14
12
10
8
26
26
30
22
24
26
26
24
24
26
24
20
18
24
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
0.796
0.796
100.0
70.0
55.0
40.0
30.0
20.0
18.0
16.0
15.0
14.0
12.0
10.0
8.0
7.0
6.0
5.5
5.0
4.5
4.0
3.0
1.9
3.6
4.3
5.3
7.2
9.5
13.6
15.0
18.5
25.0
29.0
42.0
63.0
94.0
110.0
127.0
149.0
160.0
235.0
350.0
490.0
890.0
7.80
7.00
6.50
6.20
5.50
4.80
4.60
4.50
4.00
3.20
2.60
2.10
1.70
1.60
1.40
1.30
1.20
1.00
0.80
0.65
0.47
8.50
7.20
6.30
6.00
4.75
4.10
3.80
3.70
3.30
2.70
2.00
1.70
1.50
1.40
1.25
1.10
1.00
0.80
0.70
0.52
0.37
266
207
169
143
124
98
89
89
81
69
56
48
41
34
33
30
26
21
17
15
12
10.0 ± 0.3
(.394 ± .012)
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple current, A),
determine core loss from
Core Loss vs. Flux Density
plot.
Core Loss vs. Flux Density
10000
7.4
TYP.
(.291)
4.8 ± 0.3
(.189 ± .012)
1000
3.4
(.134)
TYP.
Core Loss (mW)
100
1 MHz
500 KHz
300 KHz
200 KHz
100 KHz
50 KHz
3.2
(.126)
TYP.
3.4
TYP.
(.134)
10
1
Recommended Layout
7.2
(.283)
REF.
0.1
100
1000
10000
1.8
(.071)
REF.
1.8
(.071)
REF.
Flux Density Bp-p (gauss)
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device
performance may vary over time.
Users should verify actual device performance in their specific applications.
DIMENSIONS:
MM
(INCHES)
3.6
(.142)
REF.
NXP MCU
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