c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T
C
= 25 °C.
g. Package limited.
Document Number: 62881
S13-1668-Rev. A, 29-Jul-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiSS40DN
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State
Resistance
a
V
DS
V
DS
/T
J
V
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
V
DS
= 50 V, V
GS
= 10 V, I
D
= 10 A
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Output Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 4 A, V
GS
½0
V
0.8
39
49
24
15
T
C
= 25 °C
40
60
1.2
75
95
A
V
ns
nC
ns
Q
g
Q
gs
Q
gd
Q
oss
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 50 V, R
L
= 5
I
D
10 A, V
GEN
= 10 V, R
g
= 1
V
DD
= 50 V, R
L
= 5
I
D
10 A, V
GEN
= 6 V, R
g
= 1
V
DS
= 50 V, V
GS
= 0 V
f = 1 MHz
0.2
V
DS
= 50 V, V
GS
= 7.5 V, I
D
= 10 A
V
DS
= 50 V, V
GS
= 6 V, I
D
= 10 A
V
DS
= 50 V, V
GS
= 0 V, f = 1 MHz
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 100 V, V
GS
= 0 V
V
DS
= 100 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
5
V, V
GS
= 10 V
V
GS
½10
V, I
D
= 10 A
V
GS
½7.5
V, I
D
= 7 A
V
GS
½6
V, I
D
= 5 A
Forward Transconductance
a
Dynamic
b
Symbol
Test Conditions
Min.
100
Typ.
Max.
Unit
V
61
- 6.8
2.3
3.5
± 100
1
10
20
0.0176
0.0190
0.0216
25
845
220
21.5
16
12.2
10
3.4
4.2
23
0.9
14
5
14
5
12
5
19
5
35
1.5
28
10
28
10
24
10
38
10
24
18.5
15
0.0210
0.0230
0.0260
mV/°C
V
nA
µA
A
S
V
DS
= 15 V, I
D
= 10 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
pF
nC
ns
Notes:
a. Pulse test; pulse width
300 µs, duty cycle
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
For technical questions, contact:
pmostechsupport@vishay.com
Document Number: 62881
S13-1668-Rev. A, 29-Jul-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiSS40DN
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
100
80
I
D
- Drain Current (A)
V
GS
= 10 V thru 7 V
60
V
GS
= 6 V
80
I
D
- Drain Current (A)
60
T
C
= 25
°C
40
40
V
GS
= 5 V
20
V
GS
= 4 V
0
0.0
1.0
2.0
3.0
4.0
5.0
20
T
C
= 125
°C
T
C
= - 55
°C
0.0
2.0
4.0
6.0
8.0
10.0
0
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.0600
Transfer Characteristics
1500
0.0500
R
DS(on)
- On-Resistance (Ω)
1200
C - Capacitance (pF)
V
GS
= 6.0 V
0.0400
900
C
iss
C
oss
0.0300
V
GS
= 7.5 V
600
0.0200
V
GS
= 10 V
300
C
rss
0
0.0100
0
16
32
48
64
80
0
16
32
48
64
80
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
R
DS(on)
- On-Resistance (Normalized)
I
D
= 10 A
V
GS
- Gate-to-Source Voltage (V)
8
V
DS
= 50 V
2.0
I
D
= 10 A
1.7
V
GS
= 10 V
6
V
DS
= 25 V
V
DS
= 75 V
1.4
V
GS
= 6.0 V
1.1
4
2
0.8
0
0.0
3.4
6.8
10.2
13.6
17.0
Q
g
- Total Gate Charge (nC)
0.5
- 50
- 25
0
25
50
75
100
125
150
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 62881
S13-1668-Rev. A, 29-Jul-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiSS40DN
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
0.10
10
I
S
- Source Current (A)
T
J
= 150
°C
1
T
J
= 25 °C
R
DS(on)
- On-Resistance (Ω)
0.08
I
D
= 10 A
0.06
0.1
0.04
T
J
= 125
°C
0.01
0.02
T
J
= 25
°C
0.001
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.00
0
2
4
6
8
10
V
SD
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
100
0.2
V
GS(th)
- Variance (V)
80
I
D
= 5 mA
- 0.4
Power (W)
150
- 0.1
60
40
- 0.7
I
D
= 250 μA
20
- 1.0
- 50
- 25
0
25
50
75
100
125
T
J
- Temperature (°C)
0
0.001
0.01
0.1
Time (s)
1
10
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
I
DM
Limited
I
D
- Drain Current (A)
10 I Limited
D
100 μs
1
Limited by R
DS(on)
*
1 ms
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.01
1s
10 s
BVDSS Limited
DC
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
For technical questions, contact:
pmostechsupport@vishay.com
Document Number: 62881
S13-1668-Rev. A, 29-Jul-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiSS40DN
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
40
32
I
D
- Drain Current (A)
24
16
8
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
65
2.0
52
1.6
Power (W)
Power (W)
39
1.2
26
0.8
13
0.4
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
0.0
0
25
50
75
100
125
T
A
- Ambient Temperature (°C)
150
Power, Junction-to-Case
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max.)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 62881
S13-1668-Rev. A, 29-Jul-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
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