FDC1765CD datasheet, PDF - EEWORLD Datasheet

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FDC1765CD: DescriptionSecondary Storage Controller, MOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，16 Pages; ManufacturerSMSC; Websitehttp://www.smsc.com/

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FDC1765CD Overview

Secondary Storage Controller, MOS, CDIP40

FDC1765CD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	101024215
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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FDC1765CD Related Products

	FDC1765CD	FDC1761CD	FDC1761P	FDC1765-02	FDC1765P	FDC1767	FDC1767P
Description	Secondary Storage Controller, MOS, CDIP40	Secondary Storage Controller, MOS, CDIP40	Secondary Storage Controller, MOS, PDIP40	Secondary Storage Controller, MOS, CDIP40	Secondary Storage Controller, MOS, PDIP40	Secondary Storage Controller, MOS, CDIP40	Secondary Storage Controller, MOS, PDIP40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Objectid	101024215	101024162	101024218	101024214	101024264	101024193	101024247
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T40	R-XDIP-T40	R-PDIP-T40	R-XDIP-T40	R-PDIP-T40	R-XDIP-T40	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	40	40	40	40	40	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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