Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
6ED003L02-F2
MA001120094
PG-TSSOP-28-1
Material Group
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
nickel
iron
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.034
14.398
19.882
0.846
0.194
8.231
56.385
1.539
1.416
0.221
0.885
Average
Mass
[%]
2.84
13.45
18.58
0.79
0.18
7.69
52.67
1.44
1.32
0.21
0.83
29. August 2013
107.03 mg
Sum
[%]
2.84
Average
Mass
[ppm]
28351
134517
32.03
0.79
185762
7906
1817
76901
60.54
1.44
1.32
526806
14383
13226
2066
1.04
8265
10331
1000000
605524
14383
13226
320279
7906
Sum
[ppm]
28351
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
EEWORLD
