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74CB3Q3257DBQRG4

Description
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-SSOP -40 to 85
Categorylogic    logic   
File Size1MB,28 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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74CB3Q3257DBQRG4 Overview

4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-SSOP -40 to 85

74CB3Q3257DBQRG4 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionSSOP, SSOP16,.25
Contacts16
Reach Compliance Codecompli
seriesCB3Q/3VH/3C/2B
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length4.9 mm
Logic integrated circuit typeMULTIPLEXER AND DEMUX/DECODER
Humidity sensitivity level2
Number of functions4
Number of entries1
Output times2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3 V
propagation delay (tpd)0.2 ns
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm

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Description 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-SSOP -40 to 85 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-VQFN -40 to 85 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-TSSOP -40 to 85 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-TSSOP -40 to 85 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-VQFN -40 to 85 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-TVSOP -40 to 85 4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-SSOP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code SOIC QFN TSSOP TSSOP QFN SOIC SOIC
package instruction SSOP, SSOP16,.25 HVQCCN, LCC16/20,.14X.16,20 TSSOP, TSSOP16,.25 TSSOP, TSSOP16,.25 HVQCCN, LCC16/20,.14X.16,20 TSSOP, TSSOP16,.25,16 SSOP, SSOP16,.25
Contacts 16 16 16 16 16 16 16
Reach Compliance Code compli compli compli compli compliant compliant compliant
series CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B
JESD-30 code R-PDSO-G16 R-PQCC-N16 R-PDSO-G16 R-PDSO-G16 R-PQCC-N16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e4 e4 e4 e4 e4 e4 e4
length 4.9 mm 4 mm 5 mm 5 mm 4 mm 4.4 mm 4.9 mm
Logic integrated circuit type MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER
Humidity sensitivity level 2 2 1 1 2 1 2
Number of functions 4 4 4 4 4 4 4
Number of entries 1 1 1 1 1 1 1
Output times 2 2 2 2 2 2 2
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP HVQCCN TSSOP TSSOP HVQCCN TSSOP SSOP
Encapsulate equivalent code SSOP16,.25 LCC16/20,.14X.16,20 TSSOP16,.25 TSSOP16,.25 LCC16/20,.14X.16,20 TSSOP16,.25,16 SSOP16,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
power supply 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
propagation delay (tpd) 0.2 ns 0.2 ns 0.2 ns 0.2 ns 0.2 ns 0.2 ns 0.2 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1 mm 1.2 mm 1.2 mm 1 mm 1.2 mm 1.75 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING NO LEAD GULL WING GULL WING NO LEAD GULL WING GULL WING
Terminal pitch 0.635 mm 0.5 mm 0.65 mm 0.65 mm 0.5 mm 0.4 mm 0.635 mm
Terminal location DUAL QUAD DUAL DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 3.5 mm 4.4 mm 4.4 mm 3.5 mm 3.6 mm 3.9 mm
Maker Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? - Lead free Lead free Lead free Lead free Lead free Lead free
Factory Lead Time - 12 weeks 6 weeks 6 weeks 1 week 1 week 12 weeks
method of packing - TR TUBE TR TR TR TR
Maximum supply current (ICC) - 0.7 mA 0.7 mA 0.7 mA 0.7 mA 0.7 mA 0.7 mA
Base Number Matches - - - 1 1 1 1
Partial list of sensors in preparation
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