|
74CB3Q3257DBQRG4 |
74CB3Q3257RGYRG4 |
SN74CB3Q3257PWG4 |
SN74CB3Q3257PWRG4 |
SN74CB3Q3257RGYR |
SN74CB3Q3257DGVR |
74CB3Q3257DBQRE4 |
| Description |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-SSOP -40 to 85 |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-VQFN -40 to 85 |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-TSSOP -40 to 85 |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-TSSOP -40 to 85 |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-VQFN -40 to 85 |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-TVSOP -40 to 85 |
4-Channel, 2:1 Switch with 5V Tolerant I/Os 16-SSOP -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Parts packaging code |
SOIC |
QFN |
TSSOP |
TSSOP |
QFN |
SOIC |
SOIC |
| package instruction |
SSOP, SSOP16,.25 |
HVQCCN, LCC16/20,.14X.16,20 |
TSSOP, TSSOP16,.25 |
TSSOP, TSSOP16,.25 |
HVQCCN, LCC16/20,.14X.16,20 |
TSSOP, TSSOP16,.25,16 |
SSOP, SSOP16,.25 |
| Contacts |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
compliant |
compliant |
compliant |
| series |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
| JESD-30 code |
R-PDSO-G16 |
R-PQCC-N16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PQCC-N16 |
R-PDSO-G16 |
R-PDSO-G16 |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
| length |
4.9 mm |
4 mm |
5 mm |
5 mm |
4 mm |
4.4 mm |
4.9 mm |
| Logic integrated circuit type |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
| Humidity sensitivity level |
2 |
2 |
1 |
1 |
2 |
1 |
2 |
| Number of functions |
4 |
4 |
4 |
4 |
4 |
4 |
4 |
| Number of entries |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Output times |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SSOP |
HVQCCN |
TSSOP |
TSSOP |
HVQCCN |
TSSOP |
SSOP |
| Encapsulate equivalent code |
SSOP16,.25 |
LCC16/20,.14X.16,20 |
TSSOP16,.25 |
TSSOP16,.25 |
LCC16/20,.14X.16,20 |
TSSOP16,.25,16 |
SSOP16,.25 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
| power supply |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
| propagation delay (tpd) |
0.2 ns |
0.2 ns |
0.2 ns |
0.2 ns |
0.2 ns |
0.2 ns |
0.2 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.75 mm |
1 mm |
1.2 mm |
1.2 mm |
1 mm |
1.2 mm |
1.75 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
| Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
| Terminal pitch |
0.635 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.5 mm |
0.4 mm |
0.635 mm |
| Terminal location |
DUAL |
QUAD |
DUAL |
DUAL |
QUAD |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
3.9 mm |
3.5 mm |
4.4 mm |
4.4 mm |
3.5 mm |
3.6 mm |
3.9 mm |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
- |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
| Factory Lead Time |
- |
12 weeks |
6 weeks |
6 weeks |
1 week |
1 week |
12 weeks |
| method of packing |
- |
TR |
TUBE |
TR |
TR |
TR |
TR |
| Maximum supply current (ICC) |
- |
0.7 mA |
0.7 mA |
0.7 mA |
0.7 mA |
0.7 mA |
0.7 mA |
| Base Number Matches |
- |
- |
- |
1 |
1 |
1 |
1 |