backside of the device are facilitated by making the
pedestal sidewalls conductive. Selective backside
metallization is applied producing a surface mount
device. The topside is fully encapsulated with
silicon nitride and has an additional polymer layer
for scratch protection. These protective coatings
prevent damage to the junction and the anode
air-bridge during handling and assembly.
These packageless devices are suitable for usage
in moderate incident power (5 W CW) or higher
incident peak power (200 W, 1 µs, 0.001 Duty)
series, shunt, or series-shunt switches. Small
parasitic inductance, 0.7 nH, and excellent RC
constant (0.20 ps) make the devices ideal for TR
switch and accessory switch circuits, where higher
P1db and IP3 values are required.
These diodes can also be used in π, T, Tapered
Resistance, and Switched-Pad Attenuator Control
Circuits for 50 Ω or 75 Ω systems.
C
D
E
F
G
DIM
A
B
C
D
INCHES
MIN
0.0207
0.0108
0.0040
0.0075
0.0032
0.0061
0.0069
MAX
0.0226
0.0128
0.0080
0.0095
0.004
0.0081
0.0089
MIN
0.525
0.275
0.102
0.190
0.081
0.155
0.175
MM
MAX
0.575
0.325
0.203
0.241
0.101
0.205
0.225
Ordering Information
Part Number
MA4SPS552
MADP-000552-12810T
1
Package
100 pc. die in carrier
3000 pc. pocket tape on reel
E
F
G
1. Reference Application Note M513 for reel size information.
2. Backside metal: 0.1 μm thick.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNT
TM
PIN Diode
Rev. V3
Electrical Specifications @ +25°C
Symbol
C
T
Parameter
Capacitance
Conditions
-40 V, 1 MHz
-40 V, 1 GHz
100 mA, 100 MHz
20 mA, 100 MHz
100 mA
10 mA
-10 µA
-40 V
Steady State
+10 mA / -6 mA
( 50% - 90% V )
Units
pF
Min.
—
Typ.
0.08
0.06
1.7
2.4
1.00
0.88
| - 275 |
| - 10 |
30
2.5
Max.
0.14
—
—
1.25
1.00
—
—
—
—
R
S
V
F
V
R
I
R
RӨ
JC
T
L
Resistance
Forward Voltage
Reverse Voltage
Reverse Leakage Current
Thermal Resistance
Lifetime
Ω
V
V
nA
°C/W
µs
—
—
| - 200 |
—
—
—
Absolute Maximum Ratings
3,4
Parameter
Dissipated RF & DC Power
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
Absolute Maximum
1W
100 mA
-200 V
-65°C to +150°C
-65°C to +150°C
+175°C
+260°C
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these devices.
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near these
survivability limits.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNT
TM
PIN Diode
Rev. V3
Typical Performance Curves
Capacitance vs. Frequency
0.20
0.18
0.16
0V
-5 V
-40 V
Capacitance vs. Voltage
0.20
0.18
0.16
CT (pF)
0.12
0.10
0.08
0.06
0.04
0.0
0.2
0.4
0.6
0.8
1.0
CT (pF)
0.14
0.14
0.12
0.10
0.08
0.06
0.04
0
10
20
30
100 MHz
1 GHz
40
Frequency (GHz)
Voltage (V)
Series Resistance vs. Frequency
4.0
Series Resistance vs. Current
100.0
3.0
100 MHz
1 GHz
R
S
(ohm)
2.0
R
S
(ohm)
10 mA
20 mA
50 mA
100 mA
10.0
1.0
0.0
0.0
0.1
0.2
0.3
0.4
0.6
0.7
0.8
0.9
1.0
1.0
0.01
0.1
1
10
100
Frequency (GHz)
Current (mA)
Series Resistance vs. Reverse Bias
1,000,000
100,000
100 MHz
1 GHz
R
P
(ohm)
10,000
1,000
0
-10
-20
-30
-40
3
Reverse Bias (-V)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
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for additional data sheets and product information.
For further information and support please visit:
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MA4SPS552
SURMOUNT
TM
PIN Diode
Rev. V3
Typical Performance Curves
Insertion Loss vs. Frequency
0.0
Isolation vs. Frequency
0
-0.2
-10
S21 (dB)
-0.4
S21 (dB)
0
1
2
3
4
5
6
-20
-0.6
-30
-0.8
-40
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
Input Return Loss vs. Frequency
-10
Output Return Loss vs. Frequency
-10
-20
-20
S11 (dB)
-30
S22 (dB)
-30
-40
0
1
2
3
4
5
6
-40
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNT
TM
PIN Diode
Rev. V3
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn and
60Sn/40Pb solder is recommended. Conductive epoxy for attachment may also be used.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device.
When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting
pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the
solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to
the top surface of the die. Equal Heat must be applied to both ohmic contacts. Since the HMIC glass is transpar-
ent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is
completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538
, “Surface Mounting Instructions“.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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