Philips Semiconductors
Preliminary specification
Standard TV microcontrollers with
On-Screen Display (OSD)
CONTENTS
1
2
3
4
5
6
6.1
6.2
7
7.1
8
8.1
8.2
8.3
8.4
8.5
8.6
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
11.4
12
12.1
12.2
12.3
12.4
13
14
14.1
15
15.1
15.2
15.3
16
16.1
17
17.1
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
Pinning
Pin description
MICROCONTROLLER
Microcontroller features
MEMORY ORGANISATION
Security bits - program and verify
RAM organisation
Data memory
SFR memory
Character set feature bits
External (auxiliary) memory
POWER-ON RESET
REDUCED POWER MODES
Idle mode
Power-down mode
Standby mode
I/O FACILITY
I/O ports
Port type
Port alternate functions
LED support
INTERRUPT SYSTEM
Interrupt enable structure
Interrupt enable priority
Interrupt vector address
Level/edge interrupt
TIMER/COUNTER
WATCHDOG TIMER
Watchdog Timer operation
PULSE WIDTH MODULATORS
PWM control
Tuning Pulse Width Modulator (TPWM)
Software ADC (SAD)
I
2
C-BUS
SERIAL I/O
I
2
C-bus port selection
MEMORY INTERFACE
Memory structure
2
17.2
17.3
17.4
18
18.1
18.2
18.3
18.4
19
19.1
19.2
19.3
19.4
19.5
19.6
19.7
19.8
19.9
19.10
19.11
19.12
19.13
19.14
20
21
22
22.1
23
23.1
23.2
23.3
24
25
26
27
27.1
27.2
27.3
27.4
28
29
30
Memory mapping
Addressing memory
Page clearing
DATA CAPTURE
SAA55xx
Data Capture Features
Broadcast service data detection
VPS acquisition
WSS acquisition
DISPLAY
Display features
Display mode
Display feature descriptions
Character and attribute coding
Screen and global controls
Screen colour
Text display control
Display positioning
Character set
Display synchronization
Video/data switch (fast blanking) polarity
Video/data switch adjustment
RGB brightness control
Contrast reduction
MEMORY MAPPED REGISTERS
LIMITING VALUES
CHARACTERISTICS
I
2
C-bus characteristics
QUALITY AND RELIABILITY
Group A
Group B
Group C
APPLICATION INFORMATION
ELECTROMAGNETIC COMPATIBILITY
(EMC) GUIDELINES
PACKAGE OUTLINE
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
1999 Oct 27
Philips Semiconductors
Preliminary specification
Standard TV microcontrollers with
On-Screen Display (OSD)
1
FEATURES
SAA55xx
•
Single-chip microcontroller with integrated On-Screen
Display (OSD)
•
Versions available with integrated data capture
•
One Time Programmable (OTP) memory for both
program Read Only Memory (ROM) and character sets
•
Single power supply: 3.0 to 3.6 V
•
5 V tolerant digital inputs and I/O
•
29 I/O lines via individual addressable controls
•
Programmable I/O for push-pull, open-drain and
quasi-bidirectional
•
Two port lines with 8 mA sink (at <0.4 V) capability, for
direct drive of Light Emitting Diode (LED)
•
Single crystal oscillator for microcontroller, OSD and
data capture
•
Power reduction modes: Idle and Power-down
•
Byte level I
2
C-bus with dual port I/O
•
Pin compatibility throughout family
•
Operating temperature:
−20
to +70
°C.
2
GENERAL DESCRIPTION
The SAA55xx standard family of microcontrollers are a
derivative of the Philips industry-standard 80C51
microcontroller, and are intended for use as the central
control mechanism in a television receiver. They provide
control functions for the television system, OSD, and some
versions include an integrated data capture and display
function.
The data capture hardware has the capability of decoding
and displaying both 525 and 625-line World System
Teletext (WST), Video Programming System (VPS) and
Wide Screen Signalling (WSS) information. The same
display hardware is used both for Teletext and OSD, which
means that the display features available give greater
flexibility to differentiate the TV set.
The SAA55xx standard family offers a range of
functionality from non-text, 16-kbyte program ROM and
256-byte Random Access Memory (RAM), to a 10-page
text version, 64-kbyte program ROM and 1.2-kbyte RAM.
3
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
Supply
V
DDX
I
DDP
I
DDC
I
DDC(id)
I
DDC(pd)
I
DDC(stb)
I
DDA
I
DDA(id)
I
DDA(pd)
I
DDA(stb)
f
xtal
T
amb
T
stg
any supply voltage (V
DD
to V
SS
)
periphery supply current
core supply current
Idle mode core supply current
Power-down mode core supply current
Standby mode core supply current
analog supply current
Idle mode analog supply current
Power-down mode analog supply current
Standby mode analog supply current
crystal frequency
operating ambient temperature
storage temperature
3.0
1
−
−
−
−
−
−
−
−
−
−20
−55
3.3
−
15
4.6
0.76
5.11
45
0.87
0.45
0.95
12
−
−
3.6
−
18
6
1
6.50
48
1.0
0.7
1.20
−
+70
+125
V
mA
mA
mA
mA
mA
mA
mA
mA
mA
MHz
°C
°C
1999 Oct 27
3
Embedded System
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