– Serial Flash Discoverable Parameters (SFDP) and Common Flash
Interface (CFI), for configuration information
Supply Voltage
– 1.7V to 2.0V
Temperature Range
– Industrial (0
°
C to +85
°
C)
– Automotive (–40
°
C to +105
°
C)
Program
– 256- or 512-byte Page Programming buffer
– Program suspend and resume
Packages (All Pb-Free)
8-lead SOIC 208 mil (SOC008) - FS128S only
WSON 6x5 mm (WND008) - FS128S only
WSON 6x8 mm (WNH008) - FS256S only
16-lead SOIC 300 mil (SO3016- FS256S only)
BGA-24 6x8 mm
– 5x5 ball (FAB024) footprint
– 4x6 ball (FAC024) footprint
– Known Good Die, and Known Tested Die
–
–
–
–
–
Erase
– Hybrid sector option
– Physical set of eight 4-kbyte sectors and one 32-kbyte sector at
the top or bottom of address space with all remaining sectors of
64 kbytes
– Uniform sector option
– Uniform 64-kbyte or 256-kbyte blocks for software compatibility
with higher density and future devices
– Erase suspend and resume
– Erase status evaluation
– 100,000 Program-Erase Cycles on any sector, minimum
– 20 Year Data Retention, typical
Publication Number
S25FS-S_00
Revision
04
Issue Date
November 6, 2013
This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qual-
ification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document
may be revised by subsequent versions or modifications due to changes in technical specifications.
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