Data Sheet
FEATURES
0.5 GHz to 4.0 GHz, GaAs, SPST Switch
HMC1055
FUNCTIONAL BLOCK DIAGRAM
HMC1055
NIC
1
GND
2
GND
3
NIC
4
8
RF2
7
V
CTL
6
V
DD
5
RF1
13718-001
Low insertion loss: 0.7 dB typical at 2.0 GHz
High input third-order intercept (IP3): >60 dBm typical
Single positive control: 0 V or 3 V
Small, surface-mount, 8-lead, 2 mm × 2 mm LFCSP package
APPLICATIONS
Cellular infrastructure
Wireless infrastructure
Mobile radios
Test equipment
Figure 1.
PACKAGE
BASE
GND
GENERAL DESCRIPTION
The
HMC1055
is a low cost, gallium arsenide (GaAs), single-
pole, single-throw (SPST) switch in a surface-mount LFCSP
package. This switch offers low insertion loss, high isolation,
and exceptional third-order intermodulation performance that
make it ideal for many cellular and wireless infrastructure
applications from 0.5 GHz to 4.0 GHz.
The
HMC1055
operates with single positive supply voltage and
a single positive control voltage at very low dc currents. RF1 is
reflective open, whereas RF2 is terminated to 50 Ω in the off state.
Rev. B
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HMC1055
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Data Sheet
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Applications Information .................................................................9
Evaluation Printed Circuit Board (PCB) ...................................9
Evaluation Board Schematic and Artwork ................................9
Outline Dimensions ....................................................................... 10
Ordering Guide .......................................................................... 10
REVISION HISTORY
8/2018—Rev. A to Rev. B
Changes to Reflow Temperature Parameter, Table 2 ................... 4
Updated Outline Dimensions ....................................................... 10
Changes to Ordering Guide .......................................................... 10
2/2016—v00.0912 to Rev. A
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Changed NC to NIC ...................................................... Throughout
Changes to Title, Features Section, Applications Section,
Figure 1, and General Description Section ................................... 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Added Figure 2; Renumbered Sequentially ...................................5
Changes to Table 3.............................................................................5
Deleted Typical Application Circuit ...............................................5
Changes to Figure 5 ...........................................................................6
Changes to Figure 11 and Figure 12................................................7
Changes to Theory of Operation Section and Table 4 .................8
Added Applications Information Section, Evaluation Printed
Circuit Board Section, Evaluation Board Schematic and
Artwork Section, and Figure 13; Renumbered Sequentially .......9
Changes to Table 5.............................................................................9
Updated Outline Dimensions ....................................................... 10
Changes to Ordering Guide .......................................................... 10
Rev. B | Page 2 of 10
Data Sheet
SPECIFICATIONS
V
DD
= 3 V , V
CTL
= 0 V or V
DD
, T
A
= 25°C, 50 Ω system, unless otherwise noted.
Table 1.
Parameter
FREQUENCY
INSERTION LOSS
ISOLATION
RETURN LOSS
On State
Off State
INPUT LINEARITY
Input 0.1 dB Compression (P0.1dB)
Input Third-Order Intercept (IP3)
SWITCHING CHARACTERISTICS
Rise/Fall Time (t
RISE
, t
FALL
)
On/Off Time (t
ON
, t
OFF
)
CURRENT
Supply (I
DD
)
Control (I
CTL
)
Test Conditions/Comments
0.5 GHz to 2.0 GHz
2.0 GHz to 4.0 GHz
0.5 GHz to 2.0 GHz
2.0 GHz to 4.0 GHz
0.5 GHz to 2.0 GHz, RF1 and RF2 ports
2.0 GHz to 4.0 GHz, RF1 and RF2 ports
0.5 GHz to 2.0 GHz, RF2 port
2.0 GHz to 4.0 GHz, RF2 port
0.5 GHz to 4.0 GHz
Two-tone input power = 15 dBm each tone
10% to 90% RF
50% V
CTL
to 90% RF
V
DD
= 3 V to 5 V
0 V or V
DD
Min
0.5
Typ
0.7
1.4
36
28
27
25
12
24
28
>60
40
50
0.2
<5
HMC1055
Max
4.0
Unit
GHz
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
ns
ns
mA
µA
Rev. B | Page 3 of 10
HMC1055
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
RF Input Power (V
DD
= 3 V, T
CASE
= 85°C)
Supply Voltage
Control Voltage Range
Continuous Power Dissipation, P
DISS
Thermal Resistance, θ
JC
(Channel to
Package Bottom)
Channel Temperature
Operating Temperature Range
Storage Temperature Range
Reflow Temperature
ESD Sensitivity, Human Body Model (HBM)
Rating
34 dBm
6.0 V
−0.2 V to V
DD
+ 0.2 V
0.88 W
74°C/W
150°C
−40°C to +85°C
−65°C to +150°C
260°C
250 V (Class 1A)
Data Sheet
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. B | Page 4 of 10
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
1
GND
2
GND
3
NIC
4
8
RF2
HMC1055
HMC1055
TOP VIEW
(Not to Scale)
7
V
CTL
6
V
DD
5
RF1
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1, 4
2, 3
5
6
7
8
Mnemonic
NIC
GND
RF1
V
DD
V
CTL
RF2
EPAD
Description
Not Internally Connected. These pins are not internally connected but can be grounded.
Ground. These pins must be connected to RF ground.
RF Input. This pin is dc-coupled and matched to 50 Ω. A blocking capacitor is required.
Supply Voltage Pin.
Control Input Pin.
RF Output. This pin is dc-coupled and matched to 50 Ω. A blocking capacitor is required.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
13718-003
13718-002
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
GND
R
V
CTL
C
13718-004
Figure 3. GND Interface Schematic
Figure 4. V
CTL
Interface Schematic
Rev. B | Page 5 of 10
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