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EXBA10P680J

Description
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.063W, 68ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1225, CHIP
CategoryPassive components    The resistor   
File Size839KB,8 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance  
Download Datasheet Parametric View All

EXBA10P680J Overview

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.063W, 68ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1225, CHIP

EXBA10P680J Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid2069967838
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time26 weeks
structureRectangular
Component power consumption0.063 W
The first element resistor68 Ω
JESD-609 codee3
Installation featuresSURFACE MOUNT
Network TypeBUSSED
Number of components8
Number of functions1
Number of terminals10
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.55 mm
Package length6.4 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.1 mm
method of packingTR, Embossed, 7 Inch
Rated temperature70 °C
resistance68 Ω
Resistor typeARRAY/NETWORK RESISTOR
Second/last element resistor68 Ω
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage50 V
Chip Resistors Networks
EXB type
EXB D, E, A, Q
Features
● High density placing for digital signal circuits
・Bussed 8 or 15 resistors for pull up/down circuits
: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch
 EXBD
 EXBE
: 4.0 mm × 2.1 mm × 0.55 mm,0.8 mm pitch
 EXBA
: 6.4 mm × 3.1 mm × 0.55 mm,1.27 mm pitch
 EXBQ
: 3.8 mm × 1.6 mm × 0.45 mm,0.5 mm pitch
・Available direct placing on the bus line by means of half pitch spacing without through-holes
on PWB (“High density placing” is shown below)
● High speed mounting using conventional placing machine
● Reference Standard
: IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
● RoHS compliant
series
【High density placing】
Pull up resistors
Vcc
Direct placement on the bus line
EXBE10C
Vcc
EXBA10P
Vcc
IC
IC
No through hole
Through holes
IC
IC
IC
IC
0.4 mm pitch
0.635 mm pitch
■ As for packaging methods, land pattern, soldering conditions and safety precautions,
please see data files.
Explanation of part numbers
1T ERJS02 ½ ERJS1Tシリーズ
1
2
3
4
5
6
7
8
9
10
11
12
E
X
B
E
1
0
C
1
0
3
J
Suffix for special requirements
Product code
Thick Film
Resistor
Networks
Dimension code of
chip resistor network
Code
D
E
A
Q
Inch
1206
1608
2512
1506
Dimensions
3.2 ×1.6 mm
4.0 ×2.1 mm
6.4 ×3.1 mm
3.8 ×1.6 mm
Number of
terminals
Circuit configuration
Code
C
P
P
E
Common terminal position
Center common circuit
(EXBD,EXBE)
Diagonal common circuit (Terminal 5
and Terminal 10) (EXBA)
One side common circuit
(Terminal 16) (EXBQ)
Diagonal common circuit (Terminal 1
and Terminal 6) (EXBA)
Resistance value
Resistance tolerance
Code Tolerance
The first two
digits are
significant figures
of resistance
value and the
third one denotes
the number of
zeros following.
J
±5 %
10
Terminals
(EXBD)
(EXBE)
(EXBA)
16
Terminals
(EXBQ)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20

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