Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAF-XC167CI-32F40F BB-A
MA000964762
PG-TQFP-144-7
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
33.010
0.529
2.293
10.581
339.310
3.590
4.981
134.483
856.707
8.638
4.833
0.649
2.595
Average
Mass
[%]
2.35
0.04
0.16
0.75
24.20
0.26
0.36
9.59
61.10
0.62
0.34
0.05
0.18
29. August 2013
1402.20 mg
Sum
[%]
2.35
Average
Mass
[ppm]
23541
377
1635
7546
25.15
0.26
241985
2560
3552
95909
71.05
0.62
0.34
610975
6160
3447
463
0.23
1850
2313
1000000
710436
6160
3447
251543
2560
Sum
[ppm]
23541
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com