EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-T0303GG-07-2522-DF

Description
Array/Network Resistor, Center Tap, Thin Film, 0.25W, 25200ohm, 100V, 0.5% +/-Tol, -25,25ppm/Cel, 0303,
CategoryPassive components    The resistor   
File Size376KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

WBC-T0303GG-07-2522-DF Overview

Array/Network Resistor, Center Tap, Thin Film, 0.25W, 25200ohm, 100V, 0.5% +/-Tol, -25,25ppm/Cel, 0303,

WBC-T0303GG-07-2522-DF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid802713825
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
Network TypeCenter Tap
Number of terminals6
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package length0.762 mm
Package formSMT
Package width0.762 mm
method of packingTray
Rated power dissipation(P)0.25 W
GuidelineMIL-PRF-38534
resistance25200 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesWBC(TAPPED)
size code0303
technologyTHIN FILM
Temperature Coefficient-25,25 ppm/°C
Tolerance0.5%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC Advanced Film Division
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
R
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
Passivation
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Gold available)
Gold
3KÅ minimum
Silicon Dioxide or
Silicon Nitride
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
R
Top contact
pad chamfered
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
Backside
½R
½R
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue April 2006
[Help] About image acquisition
I am working on an image acquisition system and want to use FIFO as a cache. However, the image keeps scrolling. I know that I have many problems. For example, when I control the reading and writing o...
老周123 FPGA/CPLD
【Industrial Production Process PDA】Material Unboxing Post- DISCOVERY KIT WITH STM32F7508-DK
It passed the second round of review on June 15th, and I hurriedly placed an order, and finally received it today. So show it: 1. Unboxing2. Front and back of the development board 3. The most critica...
csjiaquan DigiKey Technology Zone
How to select capacitor and inductor components for portable systems (Part 1)
[b]When designers think of passive components, they think of the manufacturing tolerances of inductors and capacitors, which are typically ± 20% or ± 10%. This is true in theory, but not in practice. ...
咖啡不加糖 Discrete Device
Carry out vehicle management and positioning projects
Now I am applying for a test development board to do some basic experiments. I hope the application will be successful. I hope you can help me a lot during the application process!!...
lanyu345 NXP MCU
An MSP430F schematic diagram, if you don't believe it, you should collect it!
[size=5]An MSP430F schematic diagram, for beginners of MSP430, if you don’t believe it, you should save it! [/size]{:1_134:}...
Aguilera Microcontroller MCU
Will 3D Touch be popular in the future?
Recently, I saw an article by QORVO mentioning that there are two mainstream ways to implement 3D Touch. The first is the "capacitive touch + force sensor" mode. In this mode, capacitive touch is resp...
alan000345 Robotics Development

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 64  2478  780  341  2033  2  50  16  7  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号