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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> MSP430FG6625IPZR
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MSP430FG6625IPZR

Description
MSP430FG662x Mixed-Signal Microcontroller 100-LQFP -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB，171 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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MSP430FG6625IPZR Overview

MSP430FG662x Mixed-Signal Microcontroller 100-LQFP -40 to 85

MSP430FG6625IPZR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeQFP
package instructionLFQFP, QFP100,.63SQ,20
Contacts100
Reach Compliance Codecompliant
Factory Lead Time16 weeks
Samacsys Description16-bit Microcontrollers - MCU 16-bit mixed signal Microcontroller
Has ADCYES
Other featuresHAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE;
Address bus width
bit size16
boundary scanYES
CPU seriesMSP430
maximum clock frequency32 MHz
DAC channelYES
DMA channelYES
External data bus width
Integrated cacheNO
JESD-30 codeS-PQFP-G100
JESD-609 codee4
length14 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels6
Number of external interrupt devices
Number of I/O lines73
Number of serial I/Os4
Number of terminals100
Number of timers4
On-chip data RAM width16
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
RAM (bytes)10240
rom(word)65536
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed20 MHz
Maximum slew rate6.6 mA
Maximum supply voltage3.6 V
Minimum supply voltage2.4 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width14 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC

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Description MSP430FG662x Mixed-Signal Microcontroller 100-LQFP -40 to 85 MSP430FG662x Mixed-Signal Microcontroller 100-LQFP -40 to 85 MSP430FG662x Mixed-Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85 MSP430FG662x Mixed-Signal Microcontroller 100-LQFP -40 to 85 MSP430FG642x Mixed-Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85 MSP430FG662x Mixed-Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85 MSP430FG642x Mixed-Signal Microcontroller 100-LQFP -40 to 85 MSP430FG642x Mixed-Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85 MSP430FG662x Mixed-Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85 MSP430FG642x Mixed-Signal Microcontroller 100-LQFP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code QFP QFP BGA QFP BGA BGA QFP BGA BGA QFP
package instruction LFQFP, QFP100,.63SQ,20 LFQFP, QFP100,.63SQ,20 VFBGA, BGA113,12X12,20 LFQFP, QFP100,.63SQ,20 VFBGA, BGA113,12X12,20 VFBGA, BGA113,12X12,20 LFQFP, QFP100,.63SQ,20 VFBGA, BGA113,12X12,20 VFBGA, BGA113,12X12,20 LFQFP, QFP100,.63SQ,20
Contacts 100 100 113 100 113 113 100 113 113 100
Reach Compliance Code compliant compliant compli compliant compli compli compliant compli compli compliant
Factory Lead Time 16 weeks 6 weeks 6 weeks 6 weeks 16 weeks 16 weeks 6 weeks 16 weeks 20 weeks 16 weeks
Has ADC YES YES YES YES YES YES YES YES YES YES
Other features HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE; HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE; HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE; HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE; ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE; ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE; ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY
bit size 16 16 16 16 16 16 16 16 16 16
boundary scan YES YES YES YES YES YES YES YES YES YES
CPU series MSP430 MSP430 MSP430 MSP430 MSP430 MSP430 MSP430 MSP430 MSP430 MSP430
maximum clock frequency 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
DAC channel YES YES YES YES YES YES YES YES YES YES
DMA channel YES YES YES YES YES YES YES YES YES YES
Integrated cache NO NO NO NO NO NO NO NO NO NO
JESD-30 code S-PQFP-G100 S-PQFP-G100 S-PBGA-B113 S-PQFP-G100 S-PBGA-B113 S-PBGA-B113 S-PQFP-G100 S-PBGA-B113 S-PBGA-B113 S-PQFP-G100
JESD-609 code e4 e4 e1 e4 e1 e1 e4 e1 e1 e4
length 14 mm 14 mm 7 mm 14 mm 7 mm 7 mm 14 mm 7 mm 7 mm 14 mm
low power mode YES YES YES YES YES YES YES YES YES YES
Humidity sensitivity level 3 3 3 3 3 3 3 3 3 3
Number of DMA channels 6 6 6 6 6 6 6 6 6 6
Number of I/O lines 73 73 73 73 73 73 73 73 73 73
Number of serial I/Os 4 4 4 4 4 4 4 4 4 4
Number of terminals 100 100 113 100 113 113 100 113 113 100
Number of timers 4 4 4 4 4 4 4 4 4 4
On-chip data RAM width 16 16 16 16 16 16 16 16 16 16
On-chip program ROM width 8 8 8 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP VFBGA LFQFP VFBGA VFBGA LFQFP VFBGA VFBGA LFQFP
Encapsulate equivalent code QFP100,.63SQ,20 QFP100,.63SQ,20 BGA113,12X12,20 QFP100,.63SQ,20 BGA113,12X12,20 BGA113,12X12,20 QFP100,.63SQ,20 BGA113,12X12,20 BGA113,12X12,20 QFP100,.63SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
RAM (bytes) 10240 8192 10240 8192 10240 10240 10240 10240 10240 10240
rom(word) 65536 131072 131072 131072 131072 65536 131072 65536 131072 65536
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 1.6 mm 1.6 mm 1 mm 1.6 mm 1 mm 1 mm 1.6 mm 1 mm 1 mm 1.6 mm
speed 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Maximum slew rate 6.6 mA 6.6 mA 6.6 mA 6.6 mA 6.6 mA 6.6 mA 6.6 mA 6.6 mA 6.6 mA 6.6 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING BALL GULL WING BALL BALL GULL WING BALL BALL GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD BOTTOM QUAD BOTTOM BOTTOM QUAD BOTTOM BOTTOM QUAD
width 14 mm 14 mm 7 mm 14 mm 7 mm 7 mm 14 mm 7 mm 7 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC

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