QBLP600-YYG
Feature:
Water clear lens
Package in tape and reel
Ultra bright 0606 LED package
GaAsP technology for Yellow
GaP technology for Yellow-Green
Application:
Status indication
Back lighting application
0606 LED
BI COLOR
Description:
These ultra bright 0606 YYG LEDs have a height
profile of 0.80mm. Combination of high brightness
output and small footprint, these LEDs are ideal for
keypad backlighting, status indication, and color
mixing applications.
Certification & Compliance:
TS16949
ISO9001
RoHS Compliant
Dimension:
Units: mm / tolerance = +/-0.1mm
Product: QBLP600-YYG
Date: December 09, 2011
Version# 1.1
Page 1 of 7
QBLP600-YYG
0606 LED
BI COLOR
λ
D
(nm)
Typ.
590
570
I
V
(mcd)
Min
Typ.
8.0
20
13
25
Electrical / Optical Characteristic
(T=25
o
C)
Product
QBLP600-YYG
Color
Yellow
Yellow-Green
I
F
(mA)
20
20
V
F
(V)
Typ.
Max
2.0
2.5
2.0
2.5
Min
585
565
Max
595
576
Absolute Maximum Rating
Part #
Yellow (GaAsP)
P
d
(mW)
75
I
F
(mA) I
FP
(mA)* V
R
(V)
30
125
125
5
5
T
OP
(
o
C)
T
ST
(
o
C)
T
SOL
(
o
C)**
260
260
-40 ~ +80 -40 ~ +85
-40 ~ +80 -40 ~ +85
Yellow-Green
75
30
(GaP)
*Duty 1/10 @ 10KHz
** IR Reflow for no more than 10 sec @ 260
o
C
Forward Voltage V
F
for AlInGaP (Red and Yellow-Green) @ I
F
=20mA
Bin
□
Min.
1.7
Max.
2.5
Unit
V
Luminous Intensity I
V
@ I
F
=20mA
Bin
7
8
9
A
B
C
Min.
3.20
5.0
8.0
12.5
16
20
Max.
5.0
8.0
12.5
16
20
25
Unit
mcd
Dominant Wavelength λ
D
for Yellow @ I
F
=20mA
Bin
m
n
Min.
585
590
Max.
590
595
Unit
nm
Dominant Wavelength λ
D
for Yellow Green @ I
F
=20mA
Bin
h
i
J
Product: QBLP600-YYG
Min.
565
568
572
Max.
568
572
576
Unit
nm
Date: December 09, 2011
Version# 1.1
Page 2 of 7
QBLP600-YYG
0606 LED
BI COLOR
Solder Profile & Footprint:
-Recommended tin glue specifications: melting temperature in the range of 178~192
O
C
-The recommended reflow soldering profile is as follows (temperatures indicated are as measured
on the surface of the LED resin):
Units: mm
tolerance: +/- 0.1mm
Product: QBLP600-YYG
Date: December 09, 2011
Version# 1.1
Page 4 of 7
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