Ordering Information .................................................................................................................................................................... 2
User Programming Interface ..................................................................................................................................... 18
Start-up output frequency and signaling types ........................................................................................................... 18
Any-frequency function ............................................................................................................................................. 19
C/SPI Control Registers...................................................................................................................................................... 28
9 I
Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 28
Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 29
Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 29
Register Address: 0x03. Frac-N PLL Feedback Divider Integer Value and Frac-N PLL Feedback Divider Fraction
Value MSW ............................................................................................................................................................... 30
Register Address: 0x05. Forward Divider, Driver Control ......................................................................................... 30
Register Address: 0x06. Driver Divider, Driver Control ............................................................................................. 31
2
C Operation ........................................................................................................................................................................ 32
10 I
I
2
C protocol ............................................................................................................................................................... 32
I
2
C Timing Specification ............................................................................................................................................ 35
I
2
C Device Address Modes ....................................................................................................................................... 36
Dimensions and Patterns ........................................................................................................................................................... 43
Additional Information ................................................................................................................................................................ 44
Revision History ......................................................................................................................................................................... 45
Rev 1.01
Page 3 of 45
www.sitime.com
SiT3521
1 to 340 MHz Elite Platform I2C/SPI Programmable Oscillator
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
1
Typ.
–
–
–
–
–
±1
–
–
–
Max.
340
Unit
MHz
Condition
Factory or user programmable, accurate to 6 decimal places
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-10
-20
-25
-50
First Year Aging
F_1y
–
+10
+20
+25
+50
–
ppm
ppm
ppm
ppm
ppm
°C
°C
°C
1
st
-year aging at 25°C
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations.
Temperature Range
Operating Temperature Range
T_use
-20
-40
-40
+70
+85
+105
Supply Voltage
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
3.3
3.0
2.8
2.5
–
–
100
–
–
–
3.63
3.3
3.08
2.75
–
30%
–
V
V
V
V
Extended Commercial
Industrial
Extended Industrial. Available only for I
2
C operation, not SPI.
Input Characteristics – OE Pin
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
VIH
VIL
Z_in
70%
–
–
Vdd
Vdd
kΩ
OE pin
OE pin
OE pin, logic high or logic low
Output Characteristics
Duty Cycle
DC
45
–
–
55
%
Startup and Output Enable/Disable Timing
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
T_start
T_oe_hw
3.0
3.8
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
T_oe_sw
–
–
6.5
µs
Rev 1.01
Page 4 of 45
www.sitime.com
SiT3521
1 to 340 MHz Elite Platform I2C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.15
–
89
58
–
32
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B.
T_jitt
–
0.225
0.1
0.225
0.11
1
0.340
0.14
0.340
0.15
1.6
ps
ps
ps
ps
ps
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 100, 156.25 or 212.5 MHz, Vdd = 3.3 V or 2.5 V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
80
61
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
400
455
50
1.375
50
470
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.1
0.21
0.1
1
0.275
0.12
0.367
0.12
1.6
ps
ps
ps
ps
ps
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 100, 156.25 or 212.5 MHz, Vdd = 3.3 V or 2.5 V
mV
mV
V
mV
ps
f = 156.25MHz See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
Hello everyone:I found out from TI's website that TI's SN55182J DUAL LINE RECEIVERS has been discontinued, but I can't find out when it was discontinued. I would like to ask those who are familiar wit...
I have been reading about filters for a long time and I think this one is very detailed. However, it is in English and talks about low-order filters as well as high-order ones, including Butterworth, ...
As the title says, I changed the 64M nandflash (k4s1208) to 128M nandflash (k9f1g08), bootloader and sjf have been changed successfully, WinCE has changed the nand related block.page and other paramet...
I am debugging 28069, CCS4.24 emulator SEED-XDS510PLUS. I encountered the following problems: There is no problem with CCS connecting to the development board and downloading. The pin write operation ...
The rapid development of the Internet has realized high-speed information transmission and resource sharing, greatly facilitating people's lives. Embedded systems are widely used in various electr...[Details]
Sailing is gaining more and more attention. How to use modern technology to assist training and improve competition results is particularly important. Considering the real-time data collection in t...[Details]
No matter which processor you are learning, the first thing you need to understand is the registers and working mode of the processor.
ARM has 37 registers, including 31 general registers and ...[Details]
introduction
Solar cells and LED lighting are typical applications of new energy and energy-saving and efficient technologies. Solar LED lighting uses solar cells to convert solar energy...[Details]
Printed circuit boards ( PCBs
)
are used in most electrical products
. If a PCB has low
insulation resistance
(IR), the performance of the circuits on the PCB will be greatly reduced...[Details]
introduction
At present, measuring instruments are developing towards networking, and each individual embedded instrument will become a node on the Internet. This system realizes the network...[Details]
With the rapid development of cities and the improvement of citizens' living standards, the number of various vehicles in cities is growing, and the demand for parking spaces in major commercial an...[Details]
1 Overview
In the field of traditional lighting, the concepts and definitions of lamps and lamps are clear. Lamps and lamps have their own applicable product standards, supporting technical st...[Details]
Electric bicycles have long been a means of transportation for lower-income groups due to their affordability. The largest concentrated expense in the use of electric vehicles is the cost of replac...[Details]
Nowadays, more and more people have digital cameras. The convenience and speed of digital cameras have gradually replaced film cameras and become the main tool for people's daily photography. The n...[Details]
Features
POE technology can ensure the safety of existing structured cabling while ensuring the normal operation of the existing network and minimizing costs. The IEEE 802.3af standard is ...[Details]
1. Introduction
With the rapid development of computer technology, communication technology, and integrated circuit technology, the large-scale application of field control instruments and equ...[Details]
For a long time, my country has implemented "community-style collective heating" for hot water heating, and settled accounts based on the heating area, regardless of whether the user uses heat. Thi...[Details]
During the global semiconductor industry recession, the automotive electronics market has performed strongly, especially the application of car remote control systems has become more and more wides...[Details]
1 Features
1.1 Single cell operating voltage up to 3.7V
It is three times that of nickel-cadmium batteries and nickel-metal hydride batteries, and nearly twice that of lead-acid batteries...[Details]
TI Technology Forum
京公网安备 11010802033920号
EEWORLD
