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MEC1-108-02-SM-D-NP-TR

Description
SINGLE PART CARD EDGE CONN
CategoryThe connector   
File Size1016KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

MEC1-108-02-SM-D-NP-TR Overview

SINGLE PART CARD EDGE CONN

MEC1-108-02-SM-D-NP-TR Parametric

Parameter NameAttribute value
Contact materialsBERYLLIUM COPPER
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
Manufacturer SeriesMEC1-1
Contact surface matchinggold (30)
Contact coated terminalsMATTE Tin
Connection TypeSingle card edge connector
F-219
MEC1–120–02–F–D–A
MEC1–130–02–F–D–A
MEC1–140–02–L–D
(1.00 mm) .0394"
MEC1 SERIES
MINI EDGE CARD SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50 µ"
(1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
2.2 A per pin
(2 adjacent pins powered)
Voltage Rating:
300 VAC
Insertion Depth:
(5.84 mm) .230" to
(8.13 mm) .320"
RoHS Compliant:
Yes
Mates with:
(1.60 mm) .062" card
Mates with
(1.60 mm)
.062" card
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
MEC1
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (05-20)
(0.15 mm) .006" max (30-70)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
14
G b p s
Optional
Alignment pin
MEC1
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
NP
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
05, 08, 20, 30, 40, 50, 60, 70
= Gold flash on contact,
Matte tin on tail
–F
–L
ALSO AVAILABLE
(MOQ Required)
• Locking Clip
(Manual placement required)
• Other platings
(6.99)
.275
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
= No
Polarization
(05, 08, 20 &
30 positions
only)
Leave
Blank for
polarization
–NP
= Alignment
Pin metal or
plastic at
Samtec
discretion.
–A
= (7.87 mm)
.310" DIA
Polyimide film
Pick &
Place Pad
–K
(No. of Positions + 2) x
(1.00) .03937 + (2.54) .100
02
140
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
Important Note:
Samtec recommends that
pads on the mating board be
Gold plated.
(0.36)
(1.00)
.014
.03937
(No. of Positions + 2)
x (1.00) .03937
01
139
(1.83)
.072
POLARIZED
POSITIONS
(No Contact)
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
= Tape & Reel
(05-60 only)
–TR
Notes:
While optimized for
50
W
applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75
W
applications.
Some sizes, styles and
options are non-standard,
non-returnable.
(8.89)
.350
(9.04)
.356
(0.15)
.006
(8.51)
.335
(0.89)
.035
DIA
(1.40)
.055
–A
OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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