CYStech Electronics Corp.
Spec. No. : C476HB
Issued Date : 2009.08.21
Revised Date : 2011.07.15
Page No. : 1/3
Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers
Reverse Voltage 50V to 1000V
Forward Current 1.0 Ampere
DBS
DB101SG thru DB107SG
Features
•
Ideal for printed circuit boards
•
Applicable for automotive insertion
•
High surge current capability
•
High temperature soldering guaranteed: 260°C, 10 seconds, 0.375”(9.5mm) lead
length at 5 lbs( 2.3kg) tension.
•
Pb-free lead plating and halogen-free package
Equivalent Circuit
Mechanical Data
•
Case: Molded plastic body, epoxy meets UL 94V-0 flammability rating
•
Terminals: Pure tin plated, solderable per J-STD-002B and JESD22-B102D
•
Polarity : as marked on body
Maximum Ratings and Electrical Characteristics
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For
capacitive load, derate current by 20%.)
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
voltage drop per leg, I
F
=1A
Maximum average forward output
rectified current at T
A
=40 °C
Peak forward surge current
@8.3ms single half sine wave
superimposed on rated load
(JEDEC method)
Rating for fusing (t<8.3ms)
Maximum DC
reverse current at
rated DC blocking
voltage per leg
(Note 1)
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
Type
DB101SG DB102SG DB103SG DB104SG DB105SG DB106SG DB107SG
Units
V
V
V
V
50
35
50
100
70
100
200
140
200
400
280
400
1.1
1
50
10
10
600
420
600
800
560
800
1000
700
1000
(Note 1)
A
A
T
A
=25
°
C
I
R
T
A
=125
°
C
R
θJA
R
θJL
C
J
Tstg
T
J
μA
500
40
15
25
-55 ~ +150
-55 ~ +150
°C /W
pF
°C
°C
Typical thermal resistance per leg
Typical diode junction capacitance
per leg @f=1MHz and applied 4V
reverse voltage
Storage temperature range
Operating temperature range
Note : 1.Units mounted on PCB with 0.47”×0.47”(12 mm×12mm) copper pads.
DB101SG thru DB107SG
CYStek Product Specification
CYStech Electronics Corp.
DBS Dimension
Spec. No. : C476HB
Issued Date : 2009.08.21
Revised Date : 2011.07.15
Page No. : 3/3
DIM
A
B
C
D
E
Inches
Min.
Max.
0.195
0.205
0.040
0.047
0.320
0.335
45° (typ)
0.120
0.130
Millimeters
Min.
Max.
5.000
5.200
1.020
1.200
8.130
8.510
45° (typ)
3.050
3.300
DIM
F
G
H
J
K
Inches
Min.
Max.
0.386
0.404
0.245
0.255
0.009
0.013
0.040
0.060
0.003
0.013
Millimeters
Min.
Max.
9.800
10.300
6.200
6.500
0.220
0.330
1.020
1.530
0.076
0.330
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead :Pure tin plated.
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DB101SG thru DB107SG
CYStek Product Specification
DSP and ARM Processors
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