EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K04B232ERWIV

Description
Fixed Resistor, Thin Film, 0.15W, 232000ohm, 125V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1505, CHIP
CategoryPassive components    The resistor   
File Size96KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

M55342K04B232ERWIV Overview

Fixed Resistor, Thin Film, 0.15W, 232000ohm, 125V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1505, CHIP

M55342K04B232ERWIV Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid931731953
package instructionCHIP
Reach Compliance Codenot_compliant
ECCN codeEAR99
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.8382 mm
Package length3.937 mm
Package formSMT
Package width1.27 mm
method of packingWaffle Pack
Rated power dissipation(P)0.15 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance232000 Ω
Resistor typeFIXED RESISTOR
size code1505
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage125 V
E/H (Military M/D55342)
www.vishay.com
Vishay Dale Thin Film
QPL MIL-PRF-55342 Qualified
Thin Film Resistor, Surface-Mount Chip
FEATURES
• Established reliability, “S” and “V” failure rate level
(10 ppm), C = 2
• High purity alumina substrate
• Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+150 °C operating conditions
LINKS TO ADDITIONAL RESOURCES
• Very low noise and voltage coefficient
(< -25 dB, 0.5 ppm/V)
• Non-inductive
• Laser-trimmed tolerances ± 0.1 %
• Wraparound resistance less than 0.010
Ω
typical
• In-lot tracking less than 5 ppm/°C
• Complete MIL-testing available in-house
• Antistatic waffle pack or tape and reel packaging available
• Military / aerospace / QPL
D
D
3
3
3D Models
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing.
CONSTRUCTION
Passivation
Resistor Film
Solder
Coating
Nickel Barrier
High Purity
Alumina Substrate
Adhesion Layer
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
SPECIFICATIONS
Tamelox resistor film (passivated nichrome)
10
Ω
to 6.19 MΩ
± 25 ppm/°C to ± 300 ppm/°C
± 0.1 %, ± 0.25 %, ± 0.5 %, ± 1 %,
± 2 %, 5 %, ± 10 %
ΔR
± 0.02 %
-
0.1 ppm/V
30 V to 200 V
-65 °C to +150 °C
-65 °C to +150 °C
< - 25 dB
ΔR
± 0.01 %
CONDITIONS
-
-
-55 °C to +125 °C
+25 °C
2000 h at +70 °C
-
-
-
-
-
-
1 year at +25 °C
Revision: 15-Nov-2021
Document Number: 60018
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
How to package a file of KEIL C
Hello everyone, I would like to ask how to package a .C file in a program, thank you!...
lemonnofeeling Embedded System
Why do we need to separate TX and RX? Let the data speak for itself!
Original article by Mr. Gaosu | Liu LijuanRegarding the TX and RX layering issue, I often hear three different opinions:"What is stratification? Um...it's up to you." "Why do you ask me to separate th...
yvonneGan PCB Design
Discussing how to take the elevator correctly based on the elevator accident in Jingzhou, Hubei
I watched the video of the Jingzhou elevator accident yesterday and was quite touched. I feel that we lack safety awareness when taking the elevator. Let's discuss how to take the elevator safely, whi...
眼大5子 Talking
Design of high-speed and massive SDRAM storage system outside DSP chip
Design of high-speed and massive SDRAM storage system outside DSP chip...
maker DSP and ARM Processors
Summary of 2009 National Undergraduate Electronic Design Competition Topic Prediction.doc
[i=s] This post was last edited by paulhyde on 2014-9-15 09:25 [/i] 2009 National Undergraduate Electronic Design Competition Topic Prediction Summary.doc...
jade Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 320  1216  2318  397  527  7  25  47  8  11 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号