REVISIONS
LTR
A
B
C
D
DESCRIPTION
Changes in accordance with NOR 5962-R305-97.
Changes in accordance with NOR 5962-R030-99.
Update boilerplate to MIL-PRF-38535 and updated appendix A. Editorial
changes throughout. – tmh
Update radiation features in section 1.5, table IB SEP test limits, and
paragraphs 4.4.4.1 – 4.4.4.4. Update boilerplate paragraphs to the current
MIL-PRF-38535 requirements. - LTG
Update radiation features in section 1.5 and add SEP table IB. Update the
boilerplate paragraphs to current requirements as specified in
MIL-PRF-38535. - MAA
DATE (YR-MO-DA)
97-10-22
99-02-19
00-07-20
10-03-25
APPROVED
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
Thomas M. Hess
E
16-12-21
Muhammad Akbar
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
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15
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18
REV
SHEET
PREPARED BY
Joseph A. Kerby
E
19
E
20
E
1
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Thanh V. Nguyen
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
95-12-20
REVISION LEVEL
E
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, RADIATION
HARDENED, ADVANCED CMOS, TRIPLE THREE-
INPUT NAND GATE, MONOLITHIC SILICON
SIZE
A
CAGE CODE
AMSC N/A
67268
5962-95652
SHEET 1 OF 20
DSCC FORM 2233
APR 97
5962-E454-16
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
F
95652
01
V
X
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
ACS10
ACS10-02 1/
Circuit function
Radiation hardened SOS, advanced CMOS,
triple three-input NAND gate
Radiation hardened SOS, advanced CMOS,
triple three-input NAND gate
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
X
Descriptive designator
CDIP2-T14
CDFP3-F14
Terminals
14
14
Package style
Dual-in-line
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1/ Device type -02 is the same as device type 01 except that the device type 02 products are manufactured at an overseas
wafer foundry. Device type 02 is used to positively identify, by marketing part number and by brand of the actual device,
material that is supplied by an overseas foundry.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95652
SHEET
E
2
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
) .................................................................................. -0.5 V dc to +7.0 V dc
DC input voltage range (V
IN
) ................................................................................ -0.5 V dc to V
CC
+ 0.5 V dc
DC output voltage range (V
OUT
) ........................................................................... -0.5 V dc to V
CC
+ 0.5 V dc
DC input current, any one input (I
IN
).....................................................................
±10
mA
DC output current, any one output (I
OUT
) .............................................................
±50
mA
Storage temperature range (T
STG
) ....................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds) .......................................................... +265°C
Thermal resistance, junction-to-case (θ
JC
):
Case outline C ................................................................................................... 24°C/W
Case outline X ................................................................................................... 30°C/W
Thermal resistance, junction-to-ambient (θ
JA
):
Case outline C ................................................................................................... 74°C/W
Case outline X ................................................................................................... 116°C/W
Junction temperature (T
J
) .................................................................................... +175°C
Maximum package power dissipation at T
A
= +125°C (P
D
): 4/
Case outline C ................................................................................................... 0.68 W
Case outline X ................................................................................................... 0.43 W
1.4 Recommended operating conditions. 2/ 3/
Supply voltage range (V
CC
) .................................................................................. +4.5 V dc to +5.5 V dc
Input voltage range (V
IN
) ...................................................................................... +0.0 V dc to V
CC
Output voltage range (V
OUT
)................................................................................. +0.0 V dc to V
CC
Maximum low level input voltage (V
IL
).................................................................. 30% of V
CC
Minimum high level input voltage (V
IH
) ................................................................. 70% of V
CC
Case operating temperature range (T
C
) ............................................................... -55°C to +125°C
Maximum input rise and fall time at V
CC
= 4.5 V (t
r
, t
f
) ......................................... 10 ns/V
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 Rad (Si)/s) ........... 300K Rad(Si)
Single event phenomenon (SEP):
No SEL occurs at effective LET (see 4.4.4.2) ....................................... ≤ 100 MeV/(mg/cm
2
) 5/
No SEU occurs at effective LET (see 4.4.4.2) ....................................... ≤ 100 MeV/(mg/cm
2
) 5/
1/
2/
3/
4/
5/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise specified, all voltages are referenced to GND.
The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range of
-55°C to +125°C unless otherwise noted.
If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is
based on
θ
JA
) at the following rate:
Case C .......................................................................................................................... 13.5 mW/°C
Case X .......................................................................................................................... 8.6 mW/°C
Limits are guaranteed by design or process, but not production tested unless specified by the customer through the
purchase order or contract.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95652
SHEET
E
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent
specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in
the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy
Ion Irradiation of Semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from: ASTM International, 100 Barr
Harbor Drive, P.O. Box C700, West Conshohocken, PA 19428-2959.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited
herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-95652
SHEET
E
4
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveform and test circuit. The switching waveforms and test circuits shall be as specified on figure 4.
3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103
(see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source
of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product
(see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 36 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95652
SHEET
E
5
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