A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Two 315M four-button wireless remote controllers of the same model (with different address codes) interfere with each other and cause the other to not work. Why? Is there a solution?...
In Windows Mobile of WINCE: When I run the programI created several child windows, some of which used some controls. Some of these controls needed to load a lot of system dll dynamic libraries. So whe...
[i=s]This post was last edited by dcexpert on 2020-10-15 13:30[/i]From: https://hackaday.io/project/174375-six-sided-neopixel-cubeI decided to build a six-sided NeoPixel cube. At first I wanted to do ...
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
On August 21st, Zhiyuan Robotics revealed at its first partner conference that it expects shipments to reach thousands of units this year and tens of thousands next year. The company hopes to reach...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
In microwave amplification circuits, the power chip is the core of the entire circuit. A large number of semiconductor devices in the chip will generate a lot of heat when working. If the heat diss...[Details]
In July 2025, stimulated by the "old for new" policy, China's new energy vehicle penetration rate reached a historic 50% mark. While industry experts like Cui Dongshu celebrated the market's perfor...[Details]
According to the latest financial report data, thanks to its leading position in advanced technology, TSMC's profit performance in the second quarter of 2025 was extremely impressive, with net prof...[Details]
Currently, PLCs are widely used in various industries, including special machine tools, machine tools, control systems, building automation, steel, petrochemicals, electricity, building materials, ...[Details]
Motor potting compound is a high-performance sealing material widely used for motor encapsulation and insulation. It is essential for motor protection and packaging. Its ideal moisture and water re...[Details]
Yongxin Technology's BCL603S2H chipset integrates the nRF54L15 system-on-chip for monitoring various sensors and achieving seamless wireless connectivity.
Oslo, Norway – August 19, 2...[Details]
summary
NFC (Near Field Communication) is a short-range, high-frequency wireless communication technology that allows contactless, point-to-point data exchange (within ten centimeters) between...[Details]