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P0404FC3.3C_11

Description
250w flip chip tvs array
File Size471KB,8 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Download Datasheet View All

P0404FC3.3C_11 Overview

250w flip chip tvs array

05154
Only One Name Means ProTek’Tion™
P0404FC3.3C - P0404FC36C
250w FliP ChiP tvs aRRay
DesCRiPtion
The P0404FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the
P0404FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance
virtually eliminates overshoot voltage due to package inductance.
FeatuRes
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration & Monolithic Structure
Protection for 1 to 3 Lines
RoHS Compliant
REACH Compliant
aPPliCations
SMART Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
MeChaniCal ChaRaCteRistiCs
Standard EIA Chip Size: 0404
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
Pin ConFiGuRation
05154.R8 2/11
Page 1
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