5962-8953603UX datasheet, PDF - EEWORLD Datasheet

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5962-8953603UX: DescriptionFIFO, 1KX9, 65ns, Asynchronous, CMOS, CQCC32,; Categorystorage storage; File Size97KB，20 Pages; ManufacturerAtmel (Microchip)

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5962-8953603UX Overview

FIFO, 1KX9, 65ns, Asynchronous, CMOS, CQCC32,

5962-8953603UX Parametric

Parameter Name	Attribute value
Objectid	103965347
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	65 ns
Maximum clock frequency (fCLK)	12.5 MHz
JESD-30 code	R-XQCC-N32
memory density	9216 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	32
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX9
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.0009 A
Maximum slew rate	0.1 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD

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REVISIONS

LTR

DESCRIPTION

DATE

APPROVED

Add device type 06. Add vendor CAGE 0HGZ7 as source of supply

for device types 01 through 04. Editorial changes throughout.

Changes in accordance with NOR 5962-R143-94.

Changes in accordance with NOR 5962-R028-95.

Updated boilerplate to reflect current requirements and made

corrections to waveforms. - glg

93-09-17

94-05-10

94-11-04

01-01-17

M. A. Frye

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

CHECKED BY

Charles Reusing

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY All DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

APPROVED BY

Monica L. Poelking

MICROCIRCUIT, MEMORY, DIGITAL, CMOS,

1K X 9 FIFO, MONOLITHIC SILICON

DRAWING APPROVAL DATE

27 March 1990

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-89536

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E179-01

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the

issue listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,

cited in the solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the

text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations

unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-

38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"

certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection

provided that each coated microcircuit inspection lot (see MIL-PRF-38535, appendix A) shall be subjected to and pass the

Internal Water-Vapor Content test (test method 1018 of MIL-STD-883). The frequency of the internal water vapor testing may

not be decreased unless approved by the preparing activity.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89536

SHEET

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