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5962-01-050-6920

Description
IC,ROM,256X4,TTL,DIP,16PIN,CERAMIC
Categorystorage    storage   
File Size491KB,8 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric

5962-01-050-6920 Overview

IC,ROM,256X4,TTL,DIP,16PIN,CERAMIC

5962-01-050-6920 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1156977063
package instructionDIP, DIP16,.3
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time60 ns
JESD-30 codeR-XDIP-T16
memory density1024 bit
Memory IC TypeMASK ROM
memory width4
Number of terminals16
word count256 words
character code256
Maximum operating temperature70 °C
Minimum operating temperature
organize256X4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.13 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
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