MT4P060-WN-A datasheet, PDF - EEWORLD Datasheet

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MT4P060-WN-A: DescriptionHIGH POWER LED; File Size386KB，5 Pages; ManufacturerMarktech; Websitehttps://www.marktechopto.com/

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MT4P060-WN-A Overview

HIGH POWER LED

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3Northway Lane North Latham,New York 12110.

Tollfree:1.800.984.5337

Phone:1.518.956.2980

Fax:1.518.785.4725

Http://www.marktechopto.com

SPECIFICATION

PART NO. :

MT4P060-WN-A

HIGH POWER LED

ATTENTION

OBSERVE PRECAUTION

FOR HANDLING

ELECTRO STATIC

SENSITIVE

DEVICES

Precautions:

TAKE NOTE OF THE FOLLOWING IN USE OF LED

Temperature in use

HIGH POWER LED

Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with

high light transparency is used; therefore, additives to improve the heat resistance or moisture

resistance (silica gel , etc) which are used for semiconductor products such as transistors

cannot be added to the resin.

Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,

please be careful on the following during use.

Avoid applying external force, stress, and excessive vibration to the resins and terminals at

high temperature. The glass transition temperature of epoxy resin used for the LED is

approximately 120-130℃.

At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or

more compared to that at normal temperature and the resin is softened.

If external force or stress is applied at that time, it may cause a wire rupture.

2. Soldering

Please be careful on the following at soldering.

After soldering, avoided applying external force, stress, and excessive vibration until the

products go to cooling process (normal temperature), <Same for products with terminal leads>

(1)

Soldering measurements:

Distance between melted solder side to bottom of resin shall be 1.6mm or longer.

(2)

Dip Soldering:

Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.

Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.

(3)

Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds

3. Insertion

Pitch of the LED leads and pitch of mounting holes need to be same

4. Others

Since the heat resistant ability of the LED resin is low, SMD components are used on the same

PCB, please mount the LED after adhesive baking process for SMD components. In case

adhesive baking is done after LED lamp insertion due to a production process reason, make

sure not to apply external force, stress, and excessive vibration to the LED and follow the

conditions below.

Baking temperature: 120℃ max.

Baking time: Within 60 seconds

If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down

the LED to normal temperature.

VER.: 03

Date: 2010/06/22

Page:4/4

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