S25FL002D0FNFI013 datasheet, PDF

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S25FL002D0FNFI013: Description2 Megabit, 1 Megabit CMOS 3.0 Volt Flash Memory with 25 MHz SPI Bus Interface; Categorystorage storage; File Size479KB，38 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S25FL002D0FNFI013 Overview

2 Megabit, 1 Megabit CMOS 3.0 Volt Flash Memory with 25 MHz SPI Bus Interface

S25FL002D0FNFI013 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	SON
package instruction	HVSON,
Contacts	8
Reach Compliance Code	compli
ECCN code	3A991.B.1.B.1
Maximum clock frequency (fCLK)	25 MHz
JESD-30 code	R-PDSO-N8
JESD-609 code	e3
length	6 mm
memory density	2097152 bi
Memory IC Type	FLASH
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX1
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	0.75 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	4.9 mm
Base Number Matches	1

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S25FL Family (Serial Peripheral Interface)

S25FL002D, S25FL001D

2 Megabit, 1 Megabit CMOS 3.0 Volt Flash Memory

with 25 MHz SPI Bus Interface

PRELIMINARY

INFORMATION

Distinctive Characteristics

ARCHITECTURAL ADVANTAGES

Single power supply operation

— Full voltage range: 2.7 to 3.6 V read and program

operations

Memory Architecture

— 2 Mb – Four sectors with 512 Kb each

— 1 Mb – Four sectors with 256 Kb each

Program

— Page Program (up to 256 bytes) in 6 ms (typical)

— Program cycles are on a page by page basis

Erase

— 0.25 s typical sector erase time (S25FL001D)

— 0.5 s typical sector erase time (S25FL002D)

— 1.0 s typical bulk erase time (S25FL001D)

— 2.0 s typical bulk erase time (S25FL002D)

Endurance

— 100,000 cycles per sector typical

Data Retention

— 20 years typical

Device ID

— Electronic signature

Process Technology

— Manufactured on 0.25 µm process technology

Package Option

— Industry Standard Pinouts

— 150 mil 8-pin SO package for 1Mb and 2Mb

— 208 mil 8-pin SO package for 2Mb only

— 8-contact WSON leadless package (6x5 mm)

PERFORMANCE CHARACTERISTICS

Speed

— 25 MHz clock rate (maximum)

Power Saving Standby Mode

— Standby Mode 1 µA (typical)

Memory Protection Features

Memory Protection

— W# pin works in conjunction with Status Register Bits

to protect specified memory areas

— Status Register Block Protection bits (BP1, BP0) in

status register configure parts of memory as read-

only

SOFTWARE FEATURES

SPI Bus Compatible Serial Interface

Publication Number

30167

Revision

Amendment

Issue Date

June 9, 2004

P r e l i m i n a r y

I n f o r m a t i o n

Table of Contents

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5

Input/Output Descriptions . . . . . . . . . . . . . . . . . . . 5

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .6

Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . .7

SPI Modes ...................................................................................................7

Figure 1. Bus Master and Memory Devices on the SPI Bus ....... 8

Figure 2. SPI Modes Supported............................................ 8

Figure 11. Page Program (PP) Instruction Sequence.............. 20

Sector Erase (SE) .................................................................................. 20

Figure 12. Sector Erase (SE) Instruction Sequence ............... 21

Bulk Erase (BE) ....................................................................................... 21

Figure 13. Bulk Erase (BE) Instruction Sequence .................. 22

Software Protect (SP) ......................................................................... 22

Figure 14. Software Protection (SP) Instruction Sequence...... 23

Release from Software Protect (RES) .............................................23

Figure 15. Release from Software Protect (RES) Instruction

Sequence........................................................................ 24

Operating Features . . . . . . . . . . . . . . . . . . . . . . . . .9

Page Programming .................................................................................. 9

Sector Erase, or Bulk Erase ................................................................. 9

Polling During a Write, Program, or Erase Cycle ........................ 9

Status Register ......................................................................................... 9

Protection Modes ..................................................................................10

Table 1. Protected Area Sizes (S25FL002D). .........................10

Table 2. Protected Area Sizes (S25FL001D). .........................10

Release from Software Protection and Read Electronic Signature

(RES), and Read ID (READ_ID) ....................................................... 24

Figure 16. Release from Software Protection and Read Electronic

Signature (RES), and Read ID (READ_ID) Instruction

Sequence........................................................................ 25

Power-up and Power-down . . . . . . . . . . . . . . . . . 26

Figure 17. Power-Up Timing............................................... 26

Table 7. Power-Up Timing ................................................. 27

Hold Condition Modes ........................................................................10

Figure 3. Hold Condition Activation...................................... 11

Memory Organization . . . . . . . . . . . . . . . . . . . . . . 12

Table 3. Sector Address Table – S25FL002D .........................12

Table 4. Sector Address Table – S25FL001D .........................12

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 5. Instruction Set. ....................................................13

Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . .

Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . .

Absolute Maximum Ratings . . . . . . . . . . . . . . . . .

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . .

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . .

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .

Write Enable (WREN) ..........................................................................14

Figure 4. Write Enable (WREN) Instruction Sequence............. 14

Write Disable (WRDI) ........................................................................ 14

Figure 5. Write Disable (WRDI) Instruction Sequence ............ 14

Read Status Register (RDSR) ............................................................. 14

Figure 6. Read Status Register (RDSR) Instruction Sequence.. 15

Figure 7. Status Register Format......................................... 15

Figure 18. AC Measurements I/O Waveform......................... 29

Table 8. Test Specifications ............................................... 29

Table 9. AC Characteristics ................................................ 30

Figure 19. SPI Mode 0 (0,0) Input Timing ............................ 31

Figure 20. SPI Mode 0 (0,0) Output Timing.......................... 31

Figure 21. HOLD# Timing.................................................. 32

Figure 22. Write Protect Setup and Hold Timing during

WRSR when SRWD=1 ....................................................... 32

Write Status Register (WRSR) .......................................................... 16

Figure 8. Write Status Register (WRSR) Instruction Sequence. 16

Table 6. Protection Modes ..................................................17

Read Data Bytes (READ) .................................................................... 17

Figure 9. Read Data Bytes (READ) Instruction Sequence ........ 18

Read Data Bytes at Higher Speed (FAST_READ) ....................... 18

Figure 10. Fast Read (FAST_READ) Instruction Sequence ....... 19

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . 33

S08 narrow—8-pin Plastic Small Outline 150mils

Body Width Package ............................................................................33

S08 wide—8-pin Plastic Small Outline 208mils

Body Width Package ............................................................................34

8-Contact WSON (6mm x 5mm) Leadless Package .................36

Page Program (PP) ................................................................................. 19

June 9, 2004 30167A+1

S25FL Family (Serial Peripheral Interface)

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