Operating Temperature Range .........................-55°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.3V,
STBY
= V
CC
, configuration byte = X0XXXX00,
T
A
= 0°C to +125°C,
unless otherwise noted.)
PARAMETER
ADC AND POWER SUPPLY
Temperature Resolution (Note 1)
Initial Temperature Error,
Local Diode (Note 2)
Temperature Error, Remote Diode
(Notes 2, 3)
Temperature Error, Local Diode
(Notes 1, 2)
Supply Voltage Range
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
Power-On Reset (POR) Threshold
POR Threshold Hysteresis
Logic inputs
forced to V
CC
or GND
SMBus static
Hardware or software standby,
SMBCLK at 10kHz
V
CC
, falling edge
1.3
V
CC
input, disables A/D conversion, rising edge
Monotonicity guaranteed
T
A
= +60°C to +100°C
T
A
= 0°C to +125°C
T
R
= +60°C to +100°C
T
R
= -55°C to +125°C
Including long-term drift
T
A
= +60°C to +100°C
T
A
= 0°C to +85°C
8
-2
-3
-3
-5
-2.5
-3.5
3.0
2.60
2.8
50
1.8
50
3
5
400
260
70
7
320
100
10
200
50
0.7
ADD0, ADD1; momentary upon power-on reset
160
V
µA
10
µA
12
700
380
130
13
µA
µA
ms
2.3
+2
+3
+3
+5
+2.5
+3.5
5.5
2.95
Bits
°C
°C
°C
V
V
mV
V
mV
CONDITIONS
MIN
TYP
MAX
UNITS
Standby Supply Current
Average Operating Supply Current
Conversion Time
Average measured over 4s; logic inputs forced
V
CC
or GND
From stop bit to conversion complete (all channels)
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NXP MCU
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