CYStech Electronics Corp.
Fast Switching Diodes
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 1/5
BAS21SH
Features
•Fast
switching speed
•Low
forward voltage drop
•Pb-free
lead plating package
SOD-123
Mechanical Data
•
Case: Molded plastic, JEDEC SOD-123.
•
Terminals: Pure tin plated, solderable per MIL-STD-202 method 208
•
Polarity: Indicated by cathode band.
•
Weight: 0.01 gram approximately
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Non-repetitive peak reverse voltage
Repetitive peak reverse voltage
Working peak reverse voltage
RMS voltage
DC blocking voltage
Forward continuous current
Average rectified output current
Peak forward surge current @
t=1ms
t=1s
Repetitive peak forward current
Power dissipation
Thermal resistance, Junction to ambient
Operating and storage temperature range
Symbol
V
RM
V
RRM
V
RWM
V
RMS
V
R
I
FM
I
O
I
FSM
I
FRM
P
D
R
θJA
T
J
;T
STG
Type
250
250
250
141
250
400
200
2.5
0.5
625
500
250
-65 ~ +150
Units
V
mA
A
mA
mW
℃
/W
℃
Ordering Information
Device
BAS21SH
Package
SOD-123
(Pb-free lead plating package)
Shipping
3000 pcs / Tape & Reel
Marking
T3
BAS21H
CYStek Product Specification
CYStech Electronics Corp.
Electrical Characteristics
@ T
A
=25℃ unless otherwise specified
Parameters
Forward voltage
Reverse current
Junction Capacitance
Reverse recovery time
Symbol
V
F
I
R
C
J
trr
Conditions
I
F
=100mA
I
F
=200mA
V
R
=200V
V
R
=0V, f=1MHz
I
F
=I
R
=30mA, Irr=0.1×I
R
,
R
L
=100Ω
Min
-
-
-
-
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 2/5
Typ.
-
-
-
-
Max
1
1.25
100
5
50
Unit
V
nA
pF
ns
Typical Characteristics
Forward Current vs Forward Voltage
1000
Instantaneous Forward Current---IF(mA)
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---IR(μA)
150°C
Pulse
width=300μs
100
150°C
10
125℃
100℃
1
75℃
10
125°C
100°C
0.1
25℃
1
75°C
25°C
0.01
0.1
0
0.3
0.6
0.9
Forward Voltage---VF(V)
1.2
1.5
0.001
0
50
100
150
200
250
Reverse Voltage---VR(V)
Junction Capacitance vs Reverse Voltage
10
Junction Capacitance---C
J
(pF)
Power Derating Curve
600
P
D
, Power Dissipation(mW)
Tj=25℃, f=1.0MHz
500
400
300
200
100
1
0.1
0.1
1
10
100
Reverse Voltage---V
R
(V)
0
0
25
50
75
100
125
150
175
T
A
, Ambient Temperature(℃)
BAS21H
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 3/5
Carrier Tape Dimension
BAS21H
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5
°C
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 4/5
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BAS21H
CYStek Product Specification
CYStech Electronics Corp.
SOD-123 Dimension
Marking:
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 5/5
T3
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
Style: Pin 1.Cathode 2.Anode
DIM
A
B
C
Inches
Min.
Max.
0.102
0.110
0.059
0.067
0.041
0.049
Millimeters
Min.
Max.
2.600
2.800
1.500
1.700
1.050
1.250
DIM
D
E
Inches
Min.
Max.
0.018
0.026
0.140
0.152
Millimeters
Min.
Max.
0.450
0.650
3.550
3.850
Notes:
1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local
CYStek
sales office.
Material:
•
Lead: Pure tin plated.
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAS21H
CYStek Product Specification
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