Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPU60R1K4C6
MA001348748
PG-TO251-3-341
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.624
0.248
0.075
248.124
0.439
0.393
11.916
118.636
3.787
0.515
0.047
0.038
1.802
Average
Mass
[%]
0.42
0.06
0.02
64.03
0.11
0.10
3.07
30.60
0.98
0.13
0.01
0.01
0.46
29. September 2015
387.64 mg
Sum
[%]
0.42
Average
Mass
[ppm]
4190
641
192
64.11
0.11
640080
1134
1013
30739
33.77
0.98
0.13
306044
9769
1329
122
97
0.48
4650
4869
1000000
337796
9769
1329
640913
1134
Sum
[ppm]
4190
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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