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L7C109DMB20L

Description
128K x 8 Static RAM
Categorystorage    storage   
File Size635KB,15 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
Download Datasheet Parametric View All

L7C109DMB20L Overview

128K x 8 Static RAM

L7C109DMB20L Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instruction0.400 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-32
Contacts32
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Is SamacsysN
Maximum access time20 ns
Other featuresAUTOMATIC POWER-DOWN
I/O typeCOMMON
JESD-30 codeR-CDIP-T32
JESD-609 codee0
length40.64 mm
memory density1048576 bi
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.4
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height4.953 mm
Maximum standby current0.0001 A
Minimum standby current2 V
Maximum slew rate0.18 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
Base Number Matches1
L7C108
L7C109
128K x 8 Static RAM
FEATURES
128K x 8 Static RAM with Chip
Select Powerdown, Output Enable
and Single or Dual Chip Selects
High Speed — to 15 ns maximum
Operational Power, -L Version
Active: 140 mA at 15 ns
Standby: 1 mA max
Data Retention at 2 V for Battery
Backup Operation
Screened to MIL-STD-883, Class B
or to SMD 5962-89598
Package Styles Available:
Pin Configuration
32-pin Ceramic DIP
32-pin Ceramic SOJ
NC
A
16
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
DQ
1
DQ
2
DQ
3
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A
15
CE
2
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
DQ
8
DQ
7
DQ
6
DQ
5
DQ
4
32-pin Quad CLCC
A
2
A
1
A
0
NC
V
CC
A
16
NC
32-pin Ceramic LCC
NC
A
16
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
DQ
1
DQ
2
DQ
3
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A
15
CE
2
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
DQ
8
DQ
7
DQ
6
DQ
5
DQ
4
4
3
2
1 32 31 30
29
28
27
26
25
24
23
22
21
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
DQ
1
5
6
7
8
9
10
11
12
13
Top
View
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
1
DQ
8
14 15 16 17 18 19 20
OVERVIEW
The L7C108 and L7C109 are high-perfor-
mance, low-power CMOS static RAMs.
The storage circuitry is organized as
131,072 words by 8 bits per word. The
8 Data In and Data Out signals share I/O
pins. The L7C108 has a single active-
low Chip Enable. The L7C109 has two
devices are available in three speeds
with maximum access times from 15 ns
to 45 ns.
Inputs and outputs are TTL compatible.
Operation is from a single +5 V power
supply. Power consumption is 140 mA
retained in inactive storage with a supply
voltage as low as 2 V.
The L7C108 and L7C109 provide asyn-
matching access and cycle times. The
Chip Enables and a three-state I/O bus
with a separate Output Enable control
simplify the connection of several chips
for increased storage capacity.
Memory locations are specified on
address pins A
0
through A
16
. For the
L7C108, reading from a designated
location is accomplished by present-
ing an address and driving CE
1
and OE
LOW while WE remains HIGH. For the
L7C109, CE
1
and OE must be LOW
while CE
2
and WE are HIGH.The data in
the addressed memory location will then
appear on the Data Out pins within one
access time. The output pins stay in a
high-impedance state when CE
1
or OE is
HIGH, or CE
2
Writing to an addressed location is
accomplished when the active-low CE
1
and WE inputs are both LOW, and CE
2
may be used to terminate the write oper-
ation. Data In and Data Out signals have
the same polarity.
Latchup and static discharge protection
are provided on-chip. The L7C108 and
L7C109 can withstand an injection cur-
rent of up to 200 mA on any pin without
damage.
DQ
2
DQ
3
V
SS
DQ
4
DQ
5
DQ
6
DQ
7
LOGIC Devices Incorporated
www.logicdevices.com
1
1M Static RAMs
Feb 17, 2012 LDS-L7C108/9-G
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