BD026-16-B-S-0-0250-0300-N-G datasheet, PDF

Datasheet> All Categories > The connector> The connector> BD026-16-B-S-0-0250-0300-N-G

BD026-16-B-S-0-0250-0300-N-G: DescriptionBoard Connector,; CategoryThe connector The connector; File Size151KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BD026-16-B-S-0-0250-0300-N-G Overview

Board Connector,

BD026-16-B-S-0-0250-0300-N-G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1343124017
Reach Compliance Code	compliant
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD FLASH
Contact completed and terminated	TIN
Contact material	COPPER ALLOY
JESD-609 code	e3
Manufacturer's serial number	BD026

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BD026: 1.27mm PITCH ELEVATED SHROUDED PIN HEADER, DUAL ROW, THROUGH HOLE, VERTICAL

1.27 (Typ.)

B±0.38

A±0.25

3.37

1.27

Typ (Non-Accum)

3.92

Ø0.85 (Typ.)

. )

Ø0

Typ

(

1.27

2.10

D±0.20

1.27

RECOMMENDED PCB LAYOUT

1.84

2.20

5.65

1.00

1.50

D±0.2

Ø0.70 (Typ)

SPECIFICATIONS

规格

E±0.2

PIN 0.40 SQ (Typ)

2.00

C±0.20

Ordering Grid

CURRENT RATING

电流额定值

: 1 AMP

INSULATOR RESISTANCE

绝缘电阻值

: 1000 MΩ Min.

No. of Contacts

DIELECTRIC WITHSTANDING

耐电压

: AC 300 V

10 to 80

CONTACT RESISTANCE

接触电阻值：

20 mΩ Max.

OPERATING TEMPERATURE

工½温度

: -40°C TO +105°C

Contact Plating

CONTACT MATERIAL

端子物料

: COPPER ALLOY

A = Gold Flash All Over

(Standard)

INSULATOR MATERIAL

绝缘½物料

B = Selective Gold Flash Contact Area/

STANDARD

标准物料

: POLYESTER

聚酯

, LCP, UL 94V-0 SOLDERING

Tin On Tail

Locating Peg

OPTION

可选物料

: POLYAMIDE

聚醯胺

, NYLON 6T, UL 94V-0

C = Tin All Over

0 = No Peg

PROCESS

可焊性

G = 10µ" Gold Contact Area/Tin On Tail

1 = With Peg

LCP (STANDARD

标准物料

) -

I = 30µ" Gold Contact Area/Tin On Tail

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec

Insulator

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

Height 'H'

NYLON 6T (OPTION

可选物料

) -

S = 5.70mm

(Standard)

IR REFLOW

回流焊

: 260°C for 10 sec.

U = 15.90mm

WAVE

波峰焊

: 230°C for 5-10 sec.

MANUAL SOLDER

人工焊接

: 350°C for 3-5sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BD065 - Allowing perfect polarisation

- Non-Polarised mating connections available - contact GCT for details

DETAIL

REV

DATE

DRAWING

RELEASE

27/03/08

SOLDER TEMP & MATES

WITH INFO. UPDATED

BD026

XXXX

Packing Options

D = Tube

(Standard)

G = Plastic Box

Insulator Material

L = LCP

(Standard)

N = Nylon 6T

Dimension E (1/100mm)

(Tail Length)

0300 = 3.00mm

(Standard)

or specify Dimension E

e.g. 0250 = 2.50mm

Dimension D (1/100mm)

(Stack Height)

1790 = 17.90mm

(Standard)

or specify Dimension D

e.g. 0250 = 2.50mm

Tolerances

(Except as noted)

Part Number:-

Date:-

Dimensions in mm

BD026

30 MAR 08

27/07/09

X.°±5°

X. ± 0.30

Description:-

.X°±2°

X.X ± 0.20

1.27mm PITCH ELEVATED SHROUDED PIN HEADER,

.XX°±1°

X.XX ± 0.15

DUAL ROW, THROUGH HOLE, VERTICAL

X.XXX ± 0.10 .XXX°±0.5°

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Third Angle Projection

Scale

NTS

Sheet No.

E & OE

1/1

www.gct.co

Material

See Note

Revision

Drawn by

Recommended Resources

Fixed three-terminal voltage stabilization application circuit 03

LA4508 audio IC amplifier circuit diagram

±50V forward switching converter circuit

Compact Bridge Sense Amplifier Circuit

Cordless phone adapter circuit diagram

Looking for software experts under WINCE5.0 system: Help me crack a learning software in it so that it can run on another WINCE5.0 system, both are ARM9 architecture. My QQ: 76697046. If you are in Shenzhen, it would be best. We can communicate face to...; fenglangxing Embedded System

pid compensation design issues: For the same system, when PID compensation is designed for the open-loop system in the S domain, are the three PID parameters obtained the same as those obtained by PID compensation design for the dis...; wxf1043265081 Power technology

Help with the new book "Real-Time Systems Development with RTEMS and Multicore Processors": Help with the new book "Real-Time Systems Development with RTEMS and Multicore Processors"...; 电子人.电子人 Real-time operating system RTOS

Problems with ground plane splitting and signal lines crossing splits: 4-layer board After the ground plane is split, it is only connected at one point. How can the signal line between the two areas not cross the split? For example, when the pulse signal from the microco...; jelly_bessie PCB Design

New Year's Day distribution!: Happy New Year to everyone!...; shixing312 Embedded System

Insulator live detector (electric field method): [align=center][align=center][b][font=楷体_GB2312][size=18pt]Live detection device for defects in insulators of high-voltage transmission lines[/size][/font][/b][font=Verdana][size=18pt][/size][/font][/a...; hvcn DSP and ARM Processors

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components