Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 0805
Applications
I
Temperature measurement and
B57620
C 620
1,25±0,15
1,3 max.
Features
I
Silver palladium termination (AgPd)
I
Cost-effective
I
Suitable for wave and reflow soldering
Termination
0,5±0,25
compensation in
– hybrid circuits
– data systems
– telecom systems
– automotive electronics
2,0±0,2
TNT0397-7-E
Options
Alternative resistance ratings and resistance tolerance
<
5% available on request
Delivery mode
Blister tape, 180-mm reel, PU: 4000 pcs
Climatic category (IEC 60068-1)
Max. power at 25
°
C (on PCB)
Resistance tolerance
Rated temperature
B
value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
R
25
No. of
R/T
characteristic
3207
3204
3205
3206
3206
1304
1010
B
25/50
K
3060
3190
3270
3420
3420
3250
3470
P
25
∆
R
N
/R
N
T
N
∆
B/B
δ
th
1)
τ
c
1)
C
th
1)
B
25/85
K
3090
3250
3290
3440
3440
3280
3510
Dimensions in mm
Approx. weight 13 mg
55/125/21
210
±
5 %,
±
10 %,
±
20 %
25
±
3%
approx. 3,5
approx. 10
approx. 35
B
25/100
K
3100
3250
3300
3450
3450
3300
3530
mW
°
C
mW/K
s
mJ/K
Ordering code
Ω
220
330
470
680
1k
2,2 k
4,7 k
B57620C0221+062
B57620C0331+062
B57620C0471+062
B57620C0681+062
B57620C0102+062
B57620C0222+062
B57620C0472+962
+: J for
∆
R
N
/R
N
=
±
5 %
K for
∆
R
N
/R
N
=
±
10 %
M for
∆
R
N
/R
N
=
±
20 %
1) Depends on mounting situation
58
05/02
Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 0805
B57620
C 620
R
25
No. of
R/T
characteristic
1011
2003
2101
2903
2904
B
25/50
K
3660
3930
4030
4120
4230
B
25/85
K
3730
3960
4080
4190
4280
B
25/100
K
3730
3980
4100
4200
4300
Ordering code
Ω
10 k
22 k
47 k
100 k
220 k
B57620C0103+062
B57620C0223+062
B57620C0473+062
B57620C0104+162
B57620C0224+062
+: J for
∆
R
N
/R
N
=
±
5 %
K for
∆
R
N
/R
N
=
±
10 %
M for
∆
R
N
/R
N
=
±
20 %
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
Test conditions
Storage at upper
category temperature
T:
(125
±
2)
°
C
t:
1000 h
Temperature of air: (40
±
2)
°
C
Relative humidity of air:
(93 +2/–3) %
Duration: 21 days
∆
R
25
/R
25
(typical)
< 3 %/
< 6 %
1)
Remarks
Storage in damp
heat, steady state
<3%
No visible
damage
Rapid temperature
cycling
Endurance
Lower test temperature: – 55
°
C < 3 %
Upper test temperature: 125
°
C
Number of cycles: 10
P
max
: 210 mW
T:
(65
±
2)
°
C
t:
1000 h
<5%
Solderability
IEC
60068-2-58
JIS C 0054
Solderability:
(215
±
3)
°
C / (3
±
0,3) s
(235
±
5)
°
C / (2
±
0,2) s
Resistance to soldering heat:
(260
±
5)
°
C / (10
±
1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
<5%
1) The higher value applies to 220
Ω
– 1 kΩ types.
59
05/02
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
++49 89 636 09, FAX (0 89) 636-2 26 89
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EPCOS AG 2002. Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne aus-
drückliche Genehmigung der EPCOS AG nicht gestattet.
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Published by EPCOS AG
Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY
++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
EPCOS’ prior express consent is prohibited.
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