BY500-50 THRU BY500-1000
SOFT RECOVERY FAST SWITCHING PLASTIC RECTIFIER
Reverse Voltage -
50 to 1000 Volts
Forward Current -
5.0 Amperes
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
High surge current capability
Fast switching for high efficiency
High forward current operation at T
L
=45
Construction utilizes void-free molded plastic technique
Especially designed for applications such as Switch Mode
Power Supplies, Inverters, Converters, TV scanning,
Ultrasonic-systems, Speed controlled DC Motors, Low
RF Interference and Free Wheeling Diode Circuits
High temperature soldering guaranteed:
250 /10 seconds, 0.375 (9.5mm) lead length,
5 lbs. (2.3Kg) tension
Mechanical Data
Case:
DO-201AD molded plastic body
Terminals:
Plated axial leads, solderable per
MIL-STD-750, method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.042 ounce, 1.195 grams
DIM
A
B
C
D
inches
Min.
0.283
0.189
0.048
1.000
DIM ENSIONS
mm
Max.
0.374
0.208
0.051
-
Min.
7.20
4.80
1.20
25.40
Max.
9.50
5.30
1.30
-
Note
Maximum Ratings and Electrical Characteristics
Ratings at 25
ambient temperature unless otherwise specified.
Symbols
BY500
-50
BY500
-100
BY500
-200
BY500
-400
BY500
-600
BY500
-800
BY500
-1000
Units
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
L
=45
Peak forward surge current
8.3mS single half sine-wave superimposed
on rated load at T
A
=25
Maximum repetitive peak forward surge
Maximum instantaneous forward voltage at 5.0A
Maximum DC reverse current
at rated DC blocking voltage
T
A
=25
T
A
=100
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
I
FRM
V
F
I
R
T
rr
I
RM(REC)
C
J
R
JA
50
35
50
100
70
100
200
140
200
400
280
400
5.0
200.0
10.0
1.35
10.0
1.0
200.0
2.0
28.0
22.0
-50 to +125
-50 to +150
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
Amps
Volts
A
mA
nS
Amps
F
/W
Maximum reverse recovery time (Note 1)
Maximum reverse recovery current (Note 1)
Typical junction capacitance (Note 2)
Typical thermal resistance (Note 3)
Operating junction temperature range
Storage temperature range
T
J
T
STG
Notes:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0MHz and applied reverse voltage of 4.0 volts
(3) Thermal resistance from junction to ambient at 0.375 (9.5mm) lead length with both leads to heat sink
1
MCU
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