TE Connectivity
PolyZen CE Series
The new PolyZen CE (Consumer Electronics) series of circuit protection devices for tablet
PCs and other portable consumer electronics is a new extension to the family. Consumer
electronics require robust circuit protection to help protect sensitive electronics from
overvoltage and overcurrent events that can result in costly product returns and warranty
issues. The low-profile (1.0 mm-height) PolyZen CE device, rated at an industry-leading
2.6A, is an innovative solution that offers significant performance advantages over discrete
solutions employing fuses, Zeners and other passive devices. The PolyZen CE series offers
board designers plug-and-play overvoltage protection devices that relieve them of the
time it takes to integrate and test less effective discrete and more costly IC solutions.
The PolyZen CE products integrate a precision Zener diode with 5.6V and 13.2V zener
voltage (Vz) options and a PolySwitch PPTC (Polymer Positive Temperature Coefficient)
device in a single, surface mount assembly. Offered in a compact thin package useful
for space constrained applications, the PolyZen CE series uses a thermally protected
KEY FEATURES
• Integrated overvoltage and
overcurrent protection
• High hold current rating
• Plug and play with +5V and +12V
Zener voltage option
• Low 1.0mm height profile
• Single component placement
Zener diode to help shield downstream electronics against voltage transients, reverse-
bias and the incorrect use of power supplies. The PolySwitch PPTC element shuts out
excessive current while the fault condition remains and helps protect the Zener diode and
downstream electronics from damage.
APPLICATIONS
•
Tablet PCs and Ultra-books
•
Global Positioning and Navigation Systems
•
HDDs, SSDs, and Personal Storage
•
Cigarette Lighter Adaptor Chargers
•
Cell phone charger port and USB power
•
Set Top Boxes and Media Players
•
Automotive Infotainment power
•
DC power port protection
•
Industrial handhelds and POS devices
BENEFITS
•
High hold current rating up to 2.6A @ 20°C meets Tablet PC requirement
•
Low profile for thin form factor consumer electronics
•
Fast clamping Zener diode helps to protect downstream electronics
•
Integrated plug-and-play device to reduce design and test time
•
Single component placement for space constrained applications
•
Protects electronics against reverse polarity power sources
•
Minimal power dissipation helps to meet total system power budget
•
RoHS Compliant and Halogen Free
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TE Connectivity
PolyZen CE Series
TYPICAL APPLICATION BLOCK DIAGRAM
Power Supply
(External or internal)
PolyZen Protected Electronics
GND
V
IN
2
1
PolyZen
Device
3
+
V
OUT
Regulated
Output
R
LOAD
Protected downstream
electronics
ELECTRICAL CHARACTERISTICS
V
Z
(V)
I
HOLD
(1)
(A)
Leakage
Current
V
INT MAX
(4)
(V)
Test
V
INT MAX
Current
(V)
(A)
16
16
16
16
24
24
5
5
5
5
3
3
I
FLT MAX
(5)
Test
Voltage
(V)
+16
-12
+16
-12
+16
-12
+16
-12
+24
-16
+24
-16
I
Zt
(A)
Max.
Min.
Part Description
ZEN132V260A16CE
ZEN056V260A16CE
ZEN132V230A16CE
ZEN056V230A16CE
ZEN132V130A24CE
ZEN056V130A24CE
13.20
5.45
13.20
5.45
13.20
5.45
Typ.
@20°C
Test
Max
@60°C Voltage Current
(V)
(mA)
2.0
2.0
13.15
5.25
13.15
5.25
13.15
5.25
5.0
10.0
5.0
10.0
5.0
10.0
R
Typ
(2)
(Ω)
R
1Max
(3)
(Ω)
Tripped Power
Dissipation
(6)
Power
(W)
1
1
1
1
1
1
I
FLT MAX
(A)
+3
-40
+5
-40
+3
-40
+5
-40
+3
-40
+10
-40
Test
Voltage
(V)
16
16
16
16
24
24
13.40
5.60
13.40
5.60
13.40
5.60
13.65
5.75
13.65
5.75
13.65
5.75
0.1
0.1
0.1
0.1
0.1
0.1
2.6
2.6
0.032
0.032
0.032
0.032
0.070
0.070
0.045
0.045
0.060
0.060
0.105
0.105
2.3 @ 20°C
2.3 @ 20°C
1.3 @ 20°C
1.3 @ 20°C
Electrical characteristics determined at 25°C unless otherwise specified.
(1) I
HOLD
: Maximum steady state input current that will not generate a trip event.
(2) R
Typ
: Resistance between V
IN
and V
OUT
pins during normal operation at room temperature.
(3) R
1MAX
: The maximum resistance between V
IN
and V
OUT
pins.
(4) V
INT MAX
: V
INT MAX
is defined as the voltage at which typical devices survived at least 100 trip cycles and 24 hours trip endurance at the specified voltage and current.
(5) I
FLT MAX
: Maximum RMS fault current the diode can withstand and remain resettable.
(6) The power dissipated by the device when in the “tripped” state.
TYPICAL FAULT RESPONSES
Typical Fault Response: ZEN056V260A16CE
Typical Fault Response: ZEN056V260A16CE
16V / 5A Current Limited Source (I
OUT
=0)
16V / 5A Current Limited Source (I
=0)
20
18
16
20
OUT
Typical Fault Response: ZEN132V130A24CE
Typical Fault Response: ZEN132V130A24CE
24V / 24V / 3A Current Limited Source (I
OUT
=0)
3A Current Limited Source (I
=0)
25
25
OUT
18
16
14
12
10
8
6
4
2
0
0.00
0.05
V
IN
V
IN
V (V) or I (A)
V
IN
20
20
V
IN
V (V) or I (A)
V (V) or I (A)
V (V) or I (A)
14
12
10
15
15
V
OUT
V
OUT
8
6
4
2
V
OUT
V
OUT
10
10
5
5
0
0.00
I
FLT
0.05
0.10
0.10
0.15
0.15
0.20
I
FLT
0.25
0.30
0.30
0.20
0.25
0
0.00
0
0.00
I
FLT
0.05
0.05
0.10
0.10
0.15
I
FLT
0.15
0.20
0.20
Time
Time (sec) (sec)
Time
Time (sec) (sec)
te.com
TE Connectivity
PolyZen CE Series
GENERAL CHARACTERISTICS FOR POLYZEN DEVICES
Operating temperature range
Storage temperature
ESD withstand
Diode capacitance
Construction
-40° to +85°C
-40° to +85°C
15kV Contact Discharge
4200pF
RoHS compliant and Halogen Free
IEC61000-4-2, Level 4
Typical @ 1MHz, 1V
RMS
DEVICE INFORMATION
Pin Configuration and Block Diagram
2-0.50+/-0.05
2-0.40+/-0.015
0.72+/-0.015
3.00+/-0.05
2
GND
1
V
IN
3
V
OUT
Pin
Number
1
2
3
Pin
1.12+/-0.05
Name
Pin Function
2-1.20+/-0.05
Polymer PTC
3.00+/-0.015
2-0.80+/-0.015
Mechanical Dimension and Recommended Pad Layout
L
Recommended Pad Layout
2-0.50+/-0.05
2.21+/-0.05
V
IN
GND
V
OUT
V
IN
= Protected input to Zener diode
GND = Ground
1.81+/-0.015
V
IN
V
OUT
Zener
Diode
V
OUT
= Zener regulated voltage output
3.80+/-0.05
GND
3.80+/-0.015
2-0.40
A
1
V
IN
2
GND
1.12+/-0.05
2.21+/-0.05
0.72+/-0
3.00+/-0.05
2-1.20+/-0.05
W
1.81+/-0.015
3
V
OUT
3.80+/-0.05
3.80+
H
Recommended Solder Stencil (mm)
(mm)
Min
Length
1
V
IN
Width
Height
Dimension
L
W
H
A
2
GND4.8
3.8
0.8
3 0.7
V
OUT
3.80+/-0.05
2-0.50+/-0.05
2-0.40+/-0.015
0.72+/-0.015
3.00+/-0.05
2-0.80+/-0.015
Typical
5.0
4.0
1.0
0.8
2.21+/-0.05
Max
1.12+/-0.05
2-1.20+/-0.05
5.2
3.00+/-0.015
4.2
1.2
0.9
1.81+/-0.015
3.80+/-0.015
Solder thinkness - 0.15mm
te.com
TE Connectivity
PolyZen CE Series
RECOMMENDED REFLOW PROFILE
Classification Reflow Profiles
Profile Feature
Average Ramp-up Rate (Ts
MAX
to Tp)
Average Ramp-down Rate (Tp to T
L
)
Preheat
• Temperature Min (Ts
MIN
)
• Temperature Max (Ts
MAX
)
• Time (ts Preheat)
Time maintained above:
• Temperature (T
L
)
• Time (t
L
)
Peak / Classification Temperature
• Temperature (T
p
)
Time within 5°C of actual peak
• Time (t
p
)
Time 25°C to peak Temperature
20-40 seconds
8 minutes max
260°C
217°C
60-150 seconds
ts Preheat
t 25°C to Peak
Time (t)
t
L
t
p
Pb-Free Assembly
3°C/second max
Temperature (T)
Tp
Ramp-up
T
L
Ts
MAX
Ts
MIN
Critical Zone
T
L
to Tp
Ramp-down
6°C/second max
150°C
200°C
60-180 seconds
PART NUMBERING SYSTEM
ZEN
056V
260A
16
CE
Special Labeling
CE = PolyZen CE Series
V
INT MAX
Rating
16 = 16V
PPTC Hold Current Group
260 = 2.6A
Zener Voltage Group
056 = 5.6V
PolyZen Product Family
DEVICE MARKING INFORMATION
VVVII
05613
Zener Voltage
5.6V
5.6V
5.6V
13.2V
13.2V
13.2V
Hold Current
1.3A
2.3A
2.6A
1.3A
2.3A
2.6A
Part Description
ZEN056V130A24CE
ZEN056V230A16CE
ZEN056V260A16CE
ZEN132V130A24CE
ZEN132V230A16CE
ZEN132V260A16CE
VVVII
####
05623
05626
13213
13223
13226
####
Last 4 digits of batch number
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