BAV19W/BAV20W/BAV21W
410mW High Voltage SMD Switching Diode
Small Signal Diode
SOD-123F
B
Features
These diodes are also available in DO-35, LL34 Package
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
C
A
D
E
F
Mechanical Data
Case : Flat lead SOD-123F small outline plastic package
Terminal: Matte tin plated, solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Polarity : Indicated by cathode band
Weight : 4.85±0.5 mg
Marking Code : H1, H2, H3
Dimensions
(mm)
A
B
C
D
E
F
Unit (mm)
Min
1.5
3.3
0.5
2.5
0.8
0.05
Max
1.7
3.9
0.7
2.7
1.15
0.2
Unit (inch)
Min
Max
0.059 0.067
0.130 0.154
0.020 0.028
0.098 0.106
0.031 0.045
0.002 0.008
Ordering Information
Part No.
BAV19W
BAV20W
BAV21W
BAV19W
BAV20W
BAV21W
Package Packing Code
Packing
SOD-123F
RH
3K / 7" Reel
SOD-123F
SOD-123F
SOD-123F
SOD-123F
SOD-123F
RH
RH
RHG
RHG
RHG
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
Marking
H1
H2
H3
H1
H2
H3
Pin Configuration
Suggested PAD Layout
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Reverse Voltage
Repetitive Peak Forward Current
Mean Forward Current
Non-Repetitive Peak Forward Surge Current
Pulse width= 1μs
Pulse width= 1s
Thermal Resistance (Junction to Ambient)
Junction and Storage Temperature Range
I
FSM
RθJA
T
J
, T
STG
4
1
375
-65 to + 150
A
°C/W
°C
Symbol
P
D
V
RRM
I
FRM
I
O
Value
410
250
625
200
Units
mW
V
mA
mA
Note1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Version : D10
BAV19W/BAV20W/BAV21W
410mW High Voltage SMD Switching Diode
Small Signal Diode
Electrical Characteristics
Type Number
Reverse Breakdown Voltage
Forward Voltage
BAV19W
BAV20W
BAV21W
(Note 2)
Symbol
V
(BR)
V
F
Min
120
200
250
-
-
-
-
-
Max
-
-
-
1.00
1.25
100
5.0
50
Units
V
V
Reverse Leakage Current
Junction Capacitance
Reverse Recovery Time
I
F
= 100mA
I
F
= 200mA
BAV19W
BAV20W
(Note 3)
BAV21W
V
R
=0, f=1.0MHz
(Note 4)
I
R
C
J
Trr
nA
pF
ns
Tape & Reel specification
TSC label
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
Item
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
K
D
A
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
2.40 Max.
1.5 ± 0.1
178 ± 1
50 Min.
13.0 ± 0.5
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.10
0.6 Max.
8.30 Max.
14.4 Max
W1
A
D2
D1
User Direction of Feed
Note 2: Test Condition : IR=100μA
Note 3: Test Condition : BAV19W @ V
R
=100V, BAV20W @ V
R
=150V, BAV21W @ V
R
=200V
Note 4: Test Condition : I
F
=I
R
=30mA, R
L
=100Ω, I
RR
=3mA
Note 5: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10° within the determined cavity.
Note 6: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : D10
BAV19W/BAV20W/BAV21W
410mW High Voltage SMD Switching Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Admissible Power Dissipation Curve
300
1000
FIG 2 Typical Forward Characterisics
Power Dissipation (mW)
200
150
100
50
0
0
25
50
75
100
125
150
Forward Current (mA)
250
100
10
1
0.1
T
j
=25°C
0.01
0
1
2
Ambient Temperature (°C)
Forward Voltage (V)
FIG 3 Leakage Current vs Junction
Temperature
100
Leakage Current (uA)
10
1
0.1
0.01
0
100
200
Junction Temperature (℃)
Version : D10
Embedded System
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