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PZU3.0B2,115

Description
zener diodes zener diode
CategoryDiscrete semiconductor    diode   
File Size122KB,13 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric View All

PZU3.0B2,115 Overview

zener diodes zener diode

PZU3.0B2,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOD
package instructionPLASTIC, SC-90, 2 PIN
Contacts2
Manufacturer packaging codeSOD323F
Reach Compliance Codecompli
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance1000 Ω
JESD-30 codeR-PDSO-F2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.31 W
Certification statusNot Qualified
GuidelineIEC-60134
Nominal reference voltage3 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance2%
Working test current5 mA
PZUxB series
Single Zener diodes in a SOD323F package
Rev. 02 — 15 November 2009
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface
Mounted Device (SMD) plastic package.
1.2 Features
Total power dissipation:
310 mW
Tolerance series: B: approximately
±5
%; B1, B2, B3: sequential, approximately
±2
%
Small plastic package suitable for surface mounted design
Wide working voltage range: nominal 2.4 V to 36 V
1.3 Applications
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
V
F
P
tot
Quick reference data
Parameter
forward voltage
total power dissipation
Conditions
I
F
= 100 mA
T
amb
25
°C
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
1.1
310
550
Unit
V
mW
mW
[1]
[2]
[3]
Pulse test: t
p
300
μs; δ ≤
0.02
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
2
.

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