RB751V-40WS
200mW, Low V
F
SMD Schottky Barrier Diode
Small Signal Diode
SOD-323F
B
Features
Low power loss, high current capability, low V
F
,
low I
R
Surface device type mounting
Moisture sensitivity level 1
Pb free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
C
A
D
E
F
Unit (mm)
Min
1.15
2.30
0.25
1.60
0.80
0.05
Max
1.40
2.80
0.40
1.80
1.10
0.15
Unit (inch)
Min
0.045
0.091
0.010
0.063
0.031
0.002
Max
0.055
0.110
0.016
0.071
0.043
0.006
Mechanical Data
Case : Flat lead SOD-323F small outline plastic package
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Polarity : Indicated by cathode band
Weight :4.6 ± 0.5 mg
Marking Code : S8
Dimensions
A
B
C
D
E
F
Pin Configuration
Ordering Information
Package
Part No.
Packing
3K / 7" Reel
Marking
S8
S8
Suggested PAD Layout
SOD-323F RB751V-40WS RR
SOD-323F RB751V-40WS RRG 3K / 7" Reel
Dimensions
X
X1
Value (in mm)
0.710
2.900
0.403
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Y
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Reverse Voltage
Reverse Voltage (DC)
Average Forward Current
Non-Repetitive Peak Forward Surge Current (Note 1)
Thermal Resistance (Junction to Ambient)
Junction Temperature
Storage Temperature Range
Symbol
P
D
V
RRM
V
R
I
O
I
FSM
RθJA
T
J
T
STG
Value
200
40
30
30
0.2
500
125
-40~125
Units
mW
V
V
mA
A
°C/W
°C
°C
Notes: 1. Test Condition : 8.3ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method)
2. ESD sensitive product hankling required.
3. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Version : B10
RB751V-40WS
200mW, Low VF SMD Schottky Barrier Diode
Small Signal Diode
Electrical Characteristics
Type Number
Forward Voltage
Reverse Leakage Current
Junction Capacitance
I
F
=1.0mA
V
R
= 30V
V
R
=1V, f=1.0MHz
Symbol
V
F
I
R
C
J
Typical
-
-
2
Max
0.37
0.5
-
Units
V
uA
pF
Tape & Reel specification
TSC label
Top Cover Tape
Item
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
K
D
A
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
2.40 Max.
1.50 +0.10
178 ± 1
50 Min.
13.0 ± 0.5
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.10
0.6 Max.
8.30 Max.
14.4 Max.
Carieer Tape
Any Additional Label (If Required)
W1
A
D2
D1
User Direction of Feed
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : B10
RB751V-40WS
200mW, Low VF SMD Schottky Barrier Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Typical Forward Characteristics
100
300
250
200
150
100
50
0.01
0
0.2
0.4
0.6
0.8
1
0
0
20
40
60
80
100
120
140
FIG 2 Admissible Power Dissipation Curve
I
F
Forward Current (mA)
10
Ta=25
o
C
1
0.1
V
F
Forward Voltage (V)
Power Dissipation (mW)
o
Ambient Tempeatature ( C)
FIG 3 Typical Junction Capacitance
5
10000
FIG. 4 Typical Reverse Characteristics
Junction Capacitance(pF)
4
I
R
Leakage Current (nA)
Ta=125
o
1000
3
2
100
Ta=25
o
1
0
0
2
4
6
8
10
12
14
10
0
5
10
15
20
25
30
35
Reverse Voltage (V)
Reverse Voltage (V)
Version : B10
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