2PTS256-636GGCS datasheet, PDF

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2PTS256-636GGCS: DescriptionIC Socket, BGA256, 256 Contact(s),; CategoryThe connector socket; File Size120KB，3 Pages; ManufacturerAdvanced Interconnections Corp.

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2PTS256-636GGCS Overview

IC Socket, BGA256, 256 Contact(s),

2PTS256-636GGCS Parametric

Parameter Name	Attribute value
Reach Compliance Code	compli
ECCN code	EAR99
Contact completed and terminated	GOLD OVER NICKEL
Device slot type	IC SOCKET
Type of equipment used	BGA256
Shell material	POLYPHENYLENE SULFIDE
JESD-609 code	e4
Number of contacts	256
Base Number Matches	1

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True BGA Socket™

Ball Grid Array Sockets

5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com

PATENTED

How It Works

Step 1

• Solder True BGA Socket™ to PCB

Step 2

• Align and place BGA device on top

of True BGA Socket mating con-

tacts. Place Chip Support Plate

over BGA device.

Step 3

• Slide Clamp over assembly. Allow

space on PCB for sliding clamp

[approximately 33% of device

package size on one side only with

new Short Slide Clamp]. Refer to

Clamp Sliding Directions for pin 1

location (see page 4).

Step 4

• Tighten Coin Screw or Finned Heat

Sink to engage compression stroke.

Guide Box

Polyimide

Wafer

Support Plate

BGA Device

Compression

Stroke (Step 4)

ADVANCED®

P.C.B.

Solder Ball

Reflowed

Heat Sink Clamp

Coin Screw

or Finned

Heat Sink

Support Plate

Not Shown

True BGA Socket™ Features

• No soldering of BGA device required.

• AIC exclusive eutectic solder ball

terminals offer superior processing.

• Uses same footprint as BGA device.

• Designed for production, develop-

ment, programming and test applica-

tions.

• Compact design maximizes PCB real

estate:

TSG = Device Pkg. Size + 0.216/(5.5mm)

TSH = Device Pkg. Size + 0.374/(9.5mm)

BGA

ADVANCED®

P.C.B.

1.27mm Pitch Terminal Options

Standard Terminals

for Test, Development and Production Applications

Terminals for LGA or

De-balled BGA Device Applications

Type -690

Surface Mount

Type -708

Thru-Hole

.183

(4.65)

Type -712

.193

(4.90)

Type -713

• Available with integral, finned heat

sink or coin screw clamp assembly.

• Currently available in 1.0 and

1.27mm pitch.

• New Short Slide Clamp reduces

required installation space on PCB.

.030 Dia.

(0.76)

.183

(4.65)

.193

(4.90)

.018 Dia.

(0.46)

.125

(3.18)

.018 Dia.

(0.46)

.125

(3.18)

.030 Dia.

(0.76)

Terminals for BGA Device Test Applications

(Consult Factory for Availability)

1.0mm Pitch Terminals

for Test, Development and Production Applications

Type -657

Type -659

Type -709

.183

(4.65)

Type -752

Surface Mount

.162

(4.11)

Type -754

Thru-Hole

.162

(4.11)

Specifications

Terminals:

Brass; Copper Alloy

(C36000)

Terminal Support:

Polyimide Film

Contacts:

Beryllium Copper (C17200)

Plating:

G – Gold over Nickel

Spring Material:

Beryllium Copper

Clamp Assembly:

Aluminum

(Heat Sink/Coin Screw, Clamp, Support Plate)

.018 Dia.

(0.46)

.183

(4.65)

.183

(4.65)

.125

(3.18)

.030 Dia.

(0.76)

.016 Dia.

(0.41)

.125

(3.18)

.024/(0.61) Dia.

.011 Dia.

(0.28)

.125

(3.18)

How To Order

Footprint Dash #

If Applicable*

True BGA Socket™

TS G XXXX - 690 G G XX

Clamp Options

YH - Heat Sink (3 Fins Std.)

YC - Coin Screw

Contact Plating

G - Gold

Terminal Type

See options above

Terminal Plating

G - Gold

Insulator Material:

Molded PPS (High Temp. Glass Filled

Thermoplastic), U.L. Rated 94V-O,

-60°C to 260°C (-76°F to 500°F)

Solder Ball:

Eutectic, 63Sn/37Pb,183°C (361°F)

Pitch

G = .050/(1.27mm) pitch

H = .039/(1.0mm) pitch

Number of Positions

*See BGA Footprint Booklet

or web site

Mechanical specifications for BGA device package required for quoting/ordering.

REV. 8/01

Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:

inch/(mm).

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