5962-8953603UC datasheet, PDF - EEWORLD Datasheet

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5962-8953603UC: DescriptionFIFO, 1KX9, 65ns, Asynchronous, CMOS, CQCC32; Categorystorage storage; File Size133KB，20 Pages; ManufacturerMatra MHS

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5962-8953603UC Overview

FIFO, 1KX9, 65ns, Asynchronous, CMOS, CQCC32

5962-8953603UC Parametric

Parameter Name	Attribute value
Objectid	2078412177
package instruction	QCCN,
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	65 ns
Other features	RETRANSMIT
period time	80 ns
JESD-30 code	R-CQCC-N32
JESD-609 code	e4
length	13.97 mm
memory density	9216 bit
memory width	9
Number of functions	1
Number of terminals	32
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX9
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.048 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm

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REVISIONS

LTR

DESCRIPTION

DATE

APPROVED

Add device type 06. Add vendor CAGE 0HGZ7 as source of supply

for device types 01 through 04. Editorial changes throughout.

Changes in accordance with NOR 5962-R143-94.

Changes in accordance with NOR 5962-R028-95.

Updated boilerplate to reflect current requirements and made

corrections to waveforms. - glg

Boilerplate update, part of 5 year review. Corrected generic number

on page 2. ksr

93-09-17

94-05-10

94-11-04

01-01-17

06-06-06

M. A. Frye

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE FOR USE BY

All DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

CHECKED BY

Charles Reusing

APPROVED BY

Monica L. Poelking

DRAWING APPROVAL DATE

27 March 1990

REVISION LEVEL

MICROCIRCUIT, MEMORY,

DIGITAL, CMOS, 1K X 9 FIFO,

MONOLITHIC SILICON

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-89536

5962-E452-06

DSCC FORM 2233

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing

(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535

may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"

certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection

provided that each coated microcircuit inspection lot (see MIL-PRF-38535, appendix A) shall be subjected to and pass the

Internal Water-Vapor Content test (test method 1018 of MIL-STD-883). The frequency of the internal water vapor testing may

not be decreased unless approved by the preparing activity.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89536

SHEET

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