LY62W1024GL-55SL datasheet, PDF

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LY62W1024GL-55SL: DescriptionStandard SRAM, 128KX8, 55ns, CMOS, PBGA36,; Categorystorage storage; File Size771KB，20 Pages; ManufacturerLyontek; Websitehttp://www.lyontek.com.tw/index.html; Environmental Compliance

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LY62W1024GL-55SL Overview

Standard SRAM, 128KX8, 55ns, CMOS, PBGA36,

LY62W1024GL-55SL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	8322626009
package instruction	TFBGA, BGA36,6X8,30
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B36
length	8 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	36
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA36,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.000008 A
Minimum standby current	1.5 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm

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LY62W1024

Rev. 1.11

128K X 8 BIT LOW POWER CMOS SRAM

REVISION HISTORY

Revision

Rev. 1.0

Rev. 1.1

Rev. 1.2

Rev. 1.3

Rev. 1.4

Description

Initial Issue

Revised I

SB1

LL/LLI-LLE(max)= 50/100

A

=> 20/50

A

LL/LLI-LLE(max)= 20/40

A

=> 12/30

A

Added SL Spec.

Revised typos in

FEATURES

Revised I

SB1

DR(MAX.)

Added I

SB1

values when T

= 25

℃

and T

= 40

℃

Revised

FEATURES

ORDERING INFORMATION

Lead free and green package available

Green package available

Added packing type in

ORDERING INFORMATION

Revised V

TERM

to V

and V

Deleted T

SOLDER

ABSOLUTE MAXIMUN RATINGS

Revised

PACKAGE OUTLINE DIMENSION

in page 10/11/12/13

Revised

ORDERING INFORMATION

in page 14

Deleted E Grade

Revised

PIN CONFIGURATION

in page 2

Correct

ORDERING INFORMATION

Typo.

Added top view of BGA in

PIN CONFIGURATION

Deleted E Grade in

ORDERING INFORMATION

Deleted

WRITE CYCLE

Notes :

1. WE#, CE# must be high or CE2 must be low during all address transitions

in page 7

Revised

GENERAL DESCRIPTION

in page 1

Revised

32-pin TSOP I & 36-ball TFBGA Package Outline Dimension

Issue Date

Aug.28.2005

Mar.30.2006

Nov.2.2007

May.6.2008

Mar.30.2009

Rev. 1.5

Rev. 1.6

Rev. 1.7

Rev. 1.8

Rev. 1.9

May.7.2010

Aug.30.2010

Aug.9.2011

Apr.06.2012

May.20.2016

Rev. 1.10

Rev. 1.11

Jun.28.2016

Feb.06.2017

Lyontek Inc.

reserves the rights to change the specifications and products without notice.

2F, No.17, Industry E. Rd. II, Science-Based Industrial Park, Hsinchu 300, Taiwan.

TEL: 886-3-6668838

FAX: 886-3-6668836

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