March 2006
THICK - FILM
CHIP RESISTOR
Head Office
314, Maetan 3 - dong, Youngtong - gu,
Suwon, Kyonggi Province 442 - 743, Korea
Europe
Te l: +82- 31- 210 - 6803
E-mail:wesley.roh@samsung.com
America
Te l: +82- 31- 210 - 6132
E-mail:semksk@samsung.com
Asia
Te l: +82 - 31- 210 - 6185
E-mail:d - y- kim@samsung.com
Domestic
Te l: +82- 31- 210 - 6144
E-mail:juheon@samsung.com
Asia sales office
Shanghai Office
200336Rm 1408 Shanghai international
trade center No 2201 Yan an(W) RD
Shanghai PRC
Te l:86 - 21- 6270 - 4168(274)
E-mail:ken.yun@samsung.com
Shenzhen Office
Rm 1903-1907, A 19F, Tianan Cyber
Times Tower, Tianan Cyber park,
Futian District Shenzhen Guang dong
province China
Te l:86 - 755 - 8347- 5500(600)
E-mail:harry7.hwang@samsung.com
Qingdao Office
Rm 1201. Crowne Plaza Qingdao;
76XiangGangZhong Rd, Qingdao;266071
P.R. China
Te l:86 - 532 - 5779102
E-mail:zhengguo.cui@samsung.com
HongKong Office
Suite 4511, Two int’l Finance Centre,
8 Finance Street, Central, Hongkong
Te l:852 - 2862 - 6320
E-mail:sail.park@samsung.com
Singapore Office
239920 83 Clemenceau Avenue
#09-11 UE Square, S’pore
Te l:(65)6833 - 3219
E-mail:changkuk.cho@samsung.com
Thai Office
Wellgrow Industrial Estate,
93 Moo 5 T. Bangsamak, A.Bangpakong
Chachoengsao 24180 Thailand
Te l:66 - 38 - 562 - 124
E-mail:skkim79@samsung.com
Taiwan Office
dd 9F - 1, Ruey Kuang Rd., Neihu,
Taipei, Taiwan
Te l:886 - 2 - 2656 - 8360
E-mail:peter- kim@samsung.com
America sales office
Irvine Office
92612 3345 Michelson Drive,
Suite 350,Irvine, CA
Te l:1- 949 - 797- 8047
E-mail:banjak@samsung.com
Europe sales office
Frankfurt Office
D-65824 Samsung Haus am
Knonberger Hang 6 Schwalwach / Ts
Te l:49 - (0)6196 - 66 - 7256
E-mail:james.pyun@samsung.com
Hungary Office
H2310, Szigetszentmiklos, Leshegy u.
2-4, Hungary
Te l:36 - 24 - 551- 148
E-mail:alex - jung@samsung.com
Manufacturing Site
Suwon Plant
314, Maetan 3- dong, Youngtong- gu,
Suwon, Kyonggi Province 442- 743, Korea
Te l: +82- 31- 218- 2063
E-mail:sh386.kim@samsung.com
Pusan Plant
1623 - 2, Songjong - dong,
Kangso - gu, Pusan 618 - 270, Korea
Te l: +82- 51- 970 - 7741
E-mail:absyong.kim@samsung.com
Tianjin Plant
27, Heiniu, Cheng - Road, Tianjin,
China 300210
Te l: +86 - 22 - 2830 - 3333(3450)
E-mail:gk.ryu@samsung.com
Philippines Plant
Calamba Premiere International Park,
Batino, Calamba, Laguna, manila
Te l: +63 - 2 - 809 - 2873
E-mail:ksj1445@samsung.com
Domestic Distributors
KORCHIP INC
#219 - 8 Gasan - dong, Gumchun - gu,
Seoul, Korea
Te l: +82 - 2 - 838 - 5588
E-mail:hjh0064@korchip.com
CHUNG HAN
#16-96 Hangang - lo 3, Youngsan - Gu,
Seoul, Korea
Te l: +82 - 2 - 718 - 3322
E-mail:james - kim@ichunghan.co.kr
SAMTEK
#154-16 Samsung- dong Kangnam- Gu,
Seoul, Korea
Te l: +82- 2- 3458- 9340
E-mail:sinsog1@samtek.co.kr
CHUNGMAC
#53-5 Wonhyolo3 Youngsan- gu,
Seoul, Korea
Te l: +82- 2- 716 - 6428~9
E-mail:any@anycam.co.kr
APEXINT
#1258 Gulo - dong Gulo-Gu, Seoul, Korea
Te l: +82- 2- 6679- 5116, 5118
E-mail:djlee@apexint.co.kr
The specification and designs contained herein may be subject to change without notice.
CONTENTS
Operation Notes
Example of Land Pattern Design
Recommended Soldering Conditions
General Purpose
Precision
Low Ohms
Trimmable Chip
4
5
6
8
10
12
14
We, Samsung, declare that our component Chip Resistor is produced in accordance with EU RoHS
directive.
1. RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in
compliance with the law and restriction.
- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
2. No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com]
Array
Characteristics Performance
Packaging
Standard Resistance Value
16
18
20
22
Certification list of Samsung Factory
Certification
TIANJIN
PHILIPPINES
ISO 9001: 2000
(Product)
QS 9000: 2001
(Product)
TL 9000
(Product)
ISO 14001
(Factory)
ISO / TS16949:2002
(Product)
OSHAS
18001
CCEMS
012RO
UL A14163
BSI FM62262
CNAB
02103I0055ROL
BSI EMS77354
Operation Notes
Applications
Chip resistors are designed for general electronic devices
such as home appliances, computer, mobile communications,
digital circuit, etc. If you require our products with high
reliability-performing at more than 125℃ or below -55℃- for
medical equipments, aircraft, high speed machines, military
usage, and items that can affect human life or if you need to
use in specific conditions (corrosive gas atmosphere), please
contact us beforehand.
Normal operation temperature ranges (℃) as follows.
-1608, 2012, 3216(general, precision) : -55℃~+155℃
-Others (rectangular, array, trimmable) : -55℃~+125℃
Although resistor body is coated, sharp excessive impact
should be avoided to prevent damages and adverse effects
on characteristics (resistor value, open circuited, T.C.R.).
Example of Land
Pattern Design
Storage
To maintain proper quality of chip components, the following
precautions are required for storage environment, method and
period.
Storage Environment
- Make sure that the ambient temperature is within 5℃~40℃
and the ambient humidity is within 20~70%RH.
- Chip components may be deformed, if the temperature of
packaged components exceeds 40℃.
- Do not store where the soldering properties can be
deterio rated by harmful gas such as sulphurous gas,
chlorine gas, etc.
- Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating.
- The remaining unused chips should be put in the original
bag and sealed again or store in a desiccator containing a
desiccating agent.
Storage Time Period
Stored chip components should be used within 6 months
after receiving the components. If 6 months or more have
elapsed, please check the solderability before actually using.
Abstract
When designing P.C.B, the shape and size of the solder lands must allow for the proper amount of solder under the resistor.
The amount of solder at the end terminations has a direct effect on the probability that the chip will crack.
The greater amount of solder, the amont of stress on the chip, and the more likely that it will break.
Use the following illustrations as guidelines for proper ‘solder lands design’.
Operation
Notes
For Rectangular Type
: Land Pattern
C
: Chip Resistor
Example of Land
Pattern Design
Mounting
Please give more attention not to press the chip owing to the
nozzle's improper height when it is mounted on PCB.
(Excessive pressure may cause exterior damage, change in
resistance, circuit open, etc.)
A
B
A
Flow soldering
Type
1005
1608
2012
3216
3225
5025
6432
(UNIT: mm)
Reflow soldering
Type
0603
1005
1608
2012
3216
3225
5025
6432
(UNIT: mm)
A
0.7
0.9
1.0
1.4
1.4
1.5
1.5
B
0.5
0.8
1.4
1.8
1.8
3.3
4.6
2A+B
1.9
2.6
3.4
4.6
4.6
6.3
7.6
C
0.5
0.8
1.3
1.6
2.6
2.5
3.2
A
0.37
0.6
0.8
0.9
1.3
1.3
1.4
1.4
B
0.28
0.5
0.8
1.4
1.8
1.8
3.3
4.6
2A+B
1.02
1.7
2.4
3.2
4.4
4.4
6.1
7.4
C
0.29
0.5
0.8
1.2
1.5
2.4
2.4
3.0
Cleaning
Soldering
Our products have Ag electrodes protected by double layer.
1st Ni coating
- This prevents Ag electrode from leaching and enhances the
bonding with Sn.
2nd Sn coating
- This is made of Sn 100% with melting point 232℃ to prevent
it from melting when solder cream melts, and to enhance
the bonding. Commercial solder creams are made of
Sn-3.0Ag-0.5Cu with melting point 217℃.
After Soldering Cleaning, soldering flux & Ionic cleaning
liquid should be avoided on product.
If any possibility on product, please take a test before usage.
Caution for Chip Resistor
Seperation from PCB.
Chip resistor installation on PCB is similar phenomenon on
chocolate chip on top of cake.
PCB has enough flexibility on outer force but Chip resistor
can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separate from Chip resistor on PCB, be ware
of any crack of chip.
For Array Type
Convex type
E
: Land Pattern
D
D
: Chip Resistor
Concave type
E
Others
Manual work
Whenever separating chip resistor from PCB, do not re-use
the chip resistor for circuit safety.
Chip resistor can be electrical specification change by
soldering Iron after separation.
Re-use of separated chip resistor should be prohibited.
Do not use more than rated voltage.
(Please check the contents of each product)
A
B
C
(UNIT: mm)
A
B
C
(UNIT: mm)
Type
102P
104P
A
0.3
0.5
B
0.3
0.4
C
0.25
0.2
D
0.5
0.5
E
0.35
0.3
Type
162P
164P
A
0.6
0.6
B
0.6
0.6
C
0.3
0.3
D
0.7
0.7
E
0.7
0.7
164P
0.7
0.5
0.3
0.9
0.65
Please refer to this land pattern when you design P.C.B. if you want.
This pattern can’t guarantee any characteristic of your product.
4
5
Recommended Soldering
Conditions
Abstract
There are 3 soldering methods.
- Flow(wave) soldering.
- Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.)
- Iron soldering.
Wave Soldering
Single Wave
Double Waves
Total Heating
Infrared Ray
Convection/Infrared
Hot Air
Hot Plate
Laser
Optical Beam
Air Heater
Reflow Soldering
Pre-heating and cooling
In the reflow soldering method, a full pre-heating at the proper
temperature is necessary to dry and activate solder paste.
Tomb-stoning can be reduced by preheating at 150~180℃ for
more than 1 minute. Also when cooling is done by dipping into
solvent, care should be taken to keep the temperature difference
within 150℃.
Standard Reflow Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the right graph. This prevents the terminations from leaching
and characteristics from deteriorating. When soldering is
repeated, the allowed time is the accumulated time.
Standard solder amount
When a PCB is warped, mechanical stress applied to the chip
should be reduced, and for doing so, care should be taken not to
use excessive amount of solder on the PCB. In case of the reflow
method, the thickness of the coated solder paste is controlled to
prevent excessive solder. The thickness of solder paste should be
100~300㎛.
℃
300
250
Peak Temp.
(260℃, 10sec max.)
Preheating
Soldering
Cooling
200
150
Soldering Methods
Reflow Soldering
100
Local Heating
Recommended
Soldering Conditions
50
※Reflow
possibility times: 2times
60~120 sec
30~40 sec
< Reflow Soldering>
Iron Soldering
Since Chip resistors come into direct contact with melted solder during soldering, it exposed to potentially mechanical stress caused
by the sudden temperature change. The chip resistors may also be subject to silver migration, and to contamination by the flux.
Because of these factors, soldering technique is critical.
Tombstoning and Prevention
When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break
away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon.
Flow(wave) Soldering
Features
There are two types of soldering methods in flow(wave) soldering.
One is single wave soldering, the other is a double wave soldering.
However, double waves soldering is mainly used. This method is
designed so that the continuous and multiple dipping processes
by waves of solder having completely different primary and
secondary characteristics and waveforms.
With the primary wave, a comparatively strong jet flow is used
to remove the flux gas and to solder.
With the secondary wave, it is used to remove excessive solder.
With the primary wave, the solder flows into a very small gap
between components and air bubbles remaining on the soldered
joint are removed.
With the secondary wave, the peel back is used to prevent bridging.
PCB
solder
- Cause of tomstoning
PCB: Form and size of land, component layout and material
Chip component: Form, size, weight and solder wetting properties
Solder paste: Particle form, particle diameter, degree of activation and coated amount
Machine: Pre-heating condition, unbalance heat system and mechanical vibration
- Preventing tombstoning
Keep land size as small as possible.
Pre-heat (Pre-heating temperature: 150~180℃, Pre-heating time: More than 1 minute )
Keep the amount of solder paste low.
Keep position deviation at a minimum when mounting chips.
When soldering, reduce thermal unbalance at both electrode of a chip.
Primary wave
Preheating
Secondary wave
℃
300
250
200
Preheating
Dipping
Cooling
If a chip component is heated suddenly during soldering, it may be
cracked by the thermal shock caused by the temperature difference
between the surface and the inside of the chip. To prevent this, a full
preheating is necessary. In case of wave soldering, the temperature
difference between solder and surface of the component is kept within
150℃. Also when cooling is done by dipping into solvent, care should be
taken to keep the temperature difference within 150℃.
Standard Soldering Condition
Soldering must be carried out without exceeding the approved soldering
temperature and time shown within the shaded area of the right graph.
An excessively long soldering time or high soldering temperature results
in leaching of the outer terminations.
When a PCB is warped, mechanical stress applied to the chip will be
increased and might be a cause of chip crack, especially if there is big
amount of solder on the chip. So, care should be taken not to use excessive
amount of solder on the PCB. For the flow(wave) soldering, the solder
amount can be controlled by land size.
Iron Soldering
Peak Temp.
(260℃ max.)
T≤150℃
150
100
50
When using a soldering iron or any other soldering operation, the permissible temperature and time should not be exceeded
that in the reflow soldering. In other to prevent the external terminations from leaching and characteristics from deteriorating,
the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering
iron and correcting with a soldering iron can be performed right the following conditions.
Item
Temperature at tip
Soldering iron output
End of soldering iron
Note
60~120 sec
10 sec max.
< Flow Soldering>
Condition
350℃ Max.
20-Watt Max.
Ø3mm
Max.
Do not directly touch the chip by the tip of the iron.
6
7
General Purpose
Feature
Very small, thin, and light weight.
Both flow and reflow soldering are applicable.
Owing to the reduced lead inductance, the high frequency
characteristic is excellent.
Suitable size and packaging for surface mount assembly.
Specification
Resistance Range (Ω)
Rated
Rated
Power Working Overload
Type Rating Voltage Voltage TCR (ppm/℃) G(±2%) J(±5%) K(±10%) Ambient
Working
Temperature Temperature
(MAX)
(MAX)
(W)
E-48
E-24
E-12
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
1/20
1/16
1/10
1/8
1/4
1/3
2/3
1
25(V)
50(V)
150(V)
200(V)
50(V)
100(V)
300(V)
400(V)
1Ω≤R 10Ω
+300/-200ppm
Ω
10Ω≤R≤1M
±100ppm
1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ
(0603:±250ppm)
Ω
Ω
1M R≤10M
±300ppm
70℃
-55℃~+125℃
-55℃~+155℃
Application
General purpose
Home Appliances
(DVD, Digital TV,CAMCODER, VTR, Digital Camera, Audio,Tunner)
For Computers & Communications
(Notebook, Memory Module, Mobile, Network Equipment, etc)
-55℃~+125℃
Structure and Dimensions
Structure
Glass or Polymer Coating
(Protective Coating)
RuO
2
type Resistor
Rated voltage (V) =
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Dimensions
I
1
√
Power Derating Curve
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to derating curve in case of the 'Jumper')
<0603, 1005, 3225, 5025, 6432>
100
100
Percentage of the rated
dissiplation(%)
80
60
Operation area
40
20
0
-55
-30
0
30
60
70
155
<1608, 2012, 3216>
General
Purpose
H
Percentage of the rated
dissiplation(%)
Alumina Substrate(96%)
Thick film Elecrtode
(Inner Electrode)
Special Plating
(Ni, Solder)
80
60
40
20
0
-55
-40
0
40
70
125
Operation area
I
2
L
W
(UNIT: mm)
Type
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
Inch
0201
0402
0603
0805
1206
1210
2010
2512
Power(W)
1/20
1/16
1/10
1/8
1/4
1/3
2/3
1
L
0.60
±0.03
1.00
±0.05
1.60
±0.10
2.00
±0.20
3.20
±0.20
3.20
±0.20
5.00
±0.20
6.30
±0.20
W
0.30
±0.03
0.50
±0.05
0.80
±0.15
1.25
±0.15
1.60
±0.15
2.55
±0.20
2.50
±0.20
3.20
±0.20
H
0.23
±0.03
0.35
±0.05
0.45
±0.10
0.50
±0.10
0.55
±0.10
0.55
±0.10
0.55
±0.10
0.55
±0.10
I
1
0.1
±0.05
0.20
±0.10
0.30
±0.20
0.40
±0.20
0.45
±0.20
0.45
±0.20
0.60
±0.20
0.60
±0.20
I
2
0.15
±0.05
0.25
±0.10
0.35
±0.10
0.35
±0.20
0.40
±0.20
0.40
±0.20
0.60
±0.20
0.60
±0.20
Average
Weight
0.15㎎
0.6㎎
2.1㎎
4.9㎎
9.5㎎
16㎎
26㎎
41㎎
80
120
Ambient Temperature(℃)
90
120
150
Ambient Temperature(℃)
Jumper Resistors
Rated
Rated
Type Resistance Current Ambient
Working
Rating Temperature Temperature
RC0603
RC1005
0.5(A)
1.0(A)
RC1608
RC2012
50m
Ω
Max.
2.0(A)
70℃
-55℃~+125℃
Marking
3 digits indication
(E-24 series)
- Left 2 digits represent significant figures.
- Last 1 digit represent exponential number of 10.
- Example:
103
Left 2 digits:
10
Last 1 digit:
3
103
=
10×10
3
Ω
=
10000Ω=10kΩ
Parts Numbering System
The part number system shall be in the following format
RC
Code Designation
2012
Dimension & Size Code
0603: 0.6×0.3(㎜) - 0201(inch)
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
3225: 3.2×2.5(㎜) - 1210(inch)
5025: 5.0×2.5(㎜) - 2010(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
J
Tolerance
G : ±2%
J : ±5%
K : ±10%
※
Jumper:’
J’
100
Resistance Value
3 or 4 digits coding system
(IEC coding system)
3digits (E-24 series)
4digits (E-96 series)
CS
Packaging Code
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
FS: Tape Packaging 13"
AS: Tape Packaging 13"
RC3216
RC3225
RC5025
RC6432
103
Jumper chip is printed as 000
Resistance below 10Ω is expressed using
“R”
ex) 7R5=7.5Ω
0603, 1005 type: No marking.
RC: Chip Resistor
8
9
Microcontroller MCU
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