HCHP2208L2204GBT131 datasheet, PDF

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HCHP2208L2204GBT131: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.75W, 2200000ohm, 200V, 2% +/-Tol, -200,200ppm/Cel, 2208,; CategoryPassive components The resistor; File Size152KB，9 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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HCHP2208L2204GBT131 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 2200000ohm, 200V, 2% +/-Tol, -200,200ppm/Cel, 2208,

HCHP2208L2204GBT131 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	966473047
Reach Compliance Code	unknown
ECCN code	EAR99
structure	Chip
JESD-609 code	e0
Number of terminals	2
Maximum operating temperature	155 °C
Minimum operating temperature	-55 °C
Package height	0.5 mm
Package length	5.58 mm
Package form	SMT
Package width	1.91 mm
method of packing	TR
Rated power dissipation(P)	0.75 W
Guideline	MIL-R-55342D
resistance	2200000 Ω
Resistor type	FIXED RESISTOR
series	HCHP HYBRID
size code	2208
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	200 ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tolerance	2%
Operating Voltage	200 V

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CHP, HCHP

Vishay Sfernice

High Stability Resistor Chips (< 0.25 % at Pn at 70 °C during 1000 h)

Thick Film Technology

FEATURES

•

Vishay Sfernice thick film resistor chips are specially

designed to meet very stringent specifications in terms

of reliability, stability < 0.25 % at Pn at + 70 °C during

1000 h, homogeneity, reproducibility and quality.

They conform

MIL-R-55342 D.

specifications

NFC

83-240

and

Robust terminations

Large ohmic value range 0.1

to 100 MΩ

Tight tolerance to 0.5 %

CHP: Standard passivated version for

industrial, professional and military applications

HCHP: For high frequency applications

ESCC approved see CHPHR

SMD wraparound chip resistor

Halogen-free according to IEC 61249-2-21 definition

Compliant to RoHS directive 2002/95/0EC

Sputtered Thin Film terminations, with nickel barrier, are very

convenient for high operating conditions. They can withstand

thousands of very severe thermal shocks.

B (W/A), N (W/A) and F (one face) types are for solder reflow

assembly.

G (W/A) and W (one face) types are for wire bonding, gluing

and even high temperature solder reflow.

Evaluated to ESCC 4001/026 (see CHPHR datasheet).

DIMENSIONS

in millimeters (inches)

VALUE

TOL.

VALUE

TOL.

1.27

0.152

0.60

0502

0.127 (0.005)

(0.050)

(0.006)

(0.024)

1.27

0.152

1.27

0.127 (0.005)

0505

(0.050)

(0.006)

(0.050)

1.52

0.152

0.85

0603

0.127 (0.005)

(0.060)

(0.006)

(0.033)

0705/

1.91

0.152

1.27

0.127 (0.005)

0805

(0.075)

(0.006)

(0.050)

2.54

0.152

1.27

0.127 (0.005)

1005

(0.100)

(0.006)

(0.050)

3.05

0.152

1.60

1206

0.127 (0.005)

(0.120)

(0.006)

(0.063)

3.81

0.152

1505

1.32 (0.052)

0.127 (0.005)

(0.150)

(0.006)

5.08

0.152

2.54 (0.100)

0.127 (0.005)

2010

(0.200)

(0.006)

2.54

0.152

5.08 (0.200)

0.127 (0.005)

1020

(0.100)

(0.006)

5.58

0.152

2208

1.91 (0.075)

0.127 (0.005)

(0.220)

(0.006)

6.35

0.152

3.06 (0.120)

0.127 (0.005)

2512

(0.250)

(0.006)

2.54

0.152

2.54 (0.100)

0.127 (0.005)

1010

(0.100)

(0.006)

* Pb containing terminations are not RoHS compliant, exemptions may apply

CASE

SIZE

www.vishay.com

VALUE

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5

(0.020)

0.5 (0.020)

TOL.

0.127 (0.005)

VALUE

0.38 (0.015)

D/E

TOL.

0.127 (0.005)

For technical questions, contact:

sfer@vishay.com

Document Number: 52023

Revision: 25-Aug-09

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