EEWORLDEEWORLDEEWORLD

Part Number

Search

3SMAJ5942B-TP

Description
zener diodes 3W 51v
Categorysemiconductor    Discrete semiconductor   
File Size255KB,4 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
Environmental Compliance  
Download Datasheet Parametric View All

3SMAJ5942B-TP Online Shopping

Suppliers Part Number Price MOQ In stock  
3SMAJ5942B-TP - - View Buy Now

3SMAJ5942B-TP Overview

zener diodes 3W 51v

3SMAJ5942B-TP Parametric

Parameter NameAttribute value
ManufactureMicro Commercial Components (MCC)
Product CategoryZener Diodes
RoHSYes
Zener Voltage51 V
Voltage Tolerance5 %
Zener Curre58 mA
Power Dissipati3 W
Maximum Reverse Leakage Curre1 uA
Maximum Zener Impedance70 Ohms
Maximum Operating Temperature+ 150 C
ConfiguratiSingle
Mounting StyleSMD/SMT
Package / CaseDO-214AC
PackagingReel
Minimum Operating Temperature- 55 C
Factory Pack Quantity3000
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMAJ5913B
THRU
3SMAJ5943B
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
Surface Mount Application
3.3V thru 56 Volt Voltage Range
Low Inductance , Low Profile Mounting
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Glass Passivated Junction
High specified maximum current (IZM) when adequately heat sinking
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)
H



J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
Note:
1.
2.
3.
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
D
B
R
thJL
25
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75
o
C
0.070"
0.085"
Revision:
A
www.mccsemi.com
1 of 4
2011/01/01

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1212  1454  2306  97  2798  25  30  47  2  57 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号