Freescale Semiconductor
Data Sheet: Technical Data
Document Number K10P144M120SF3
Rev 5, 10/2013
Supports the following:
MK10FX512VLQ12,
MK10FN1M0VLQ12,
MK10FX512VMD12,
MK10FN1M0VMD12
Key features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 120 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 1024 KB program flash memory on non-
FlexMemory devices
– Up to 512 KB program flash memory on
FlexMemory devices
– Up to 512 KB FlexNVM on FlexMemory devices
– 16 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
– NAND flash controller interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 32-channel DMA controller, supporting up to
128 request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per
chip
• Human-machine interface
– Low-power hardware touch sensor interface
(TSI)
– General-purpose input/output
• Analog modules
– Four 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Four analog comparators (CMP) containing a 6-
bit DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Two 8-channel motor control/general purpose/
PWM timers
– Two 2-channel quadrature decoder/general
purpose timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB high-/full-/low-speed On-the-Go controller
with ULPI interface
– USB Device Charger detect
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital host controller (SDHC)
– Two I2S modules
K10 Sub-Family
K10P144M120SF3
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................5
1.1 Determining valid orderable parts......................................5
2 Part identification......................................................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3 Terminology and guidelines......................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................7
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................9
3.9 Typical value conditions....................................................10
4 Ratings......................................................................................10
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5 General.....................................................................................12
5.1 AC electrical characteristics..............................................12
5.2 Nonswitching electrical specifications...............................12
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements.........12
LVD and POR operating requirements.................13
Voltage and current operating behaviors..............14
Power mode transition operating behaviors..........16
Power consumption operating behaviors..............17
EMC radiated emissions operating behaviors.......20
Designing with radiated emissions in mind...........20
Capacitance attributes..........................................21
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
5.5 Power sequencing.............................................................24
6 Peripheral operating requirements and behaviors....................25
6.1 Core modules....................................................................25
6.1.1
6.1.2
Debug trace timing specifications.........................25
JTAG electricals....................................................26
6.2 System modules................................................................29
6.3 Clock modules...................................................................29
6.3.1
6.3.2
6.3.3
MCG specifications...............................................29
Oscillator electrical specifications.........................31
32 kHz oscillator electrical characteristics.............33
6.4 Memories and memory interfaces.....................................34
6.4.1
6.4.2
6.4.3
6.4.4
Flash (FTFE) electrical specifications...................34
EzPort switching specifications.............................38
NFC specifications................................................39
Flexbus switching specifications...........................42
6.5 Security and integrity modules..........................................45
6.6 Analog...............................................................................45
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications.................................45
CMP and 6-bit DAC electrical specifications.........53
12-bit DAC electrical characteristics.....................55
Voltage reference electrical specifications............58
6.7 Timers................................................................................59
6.8 Communication interfaces.................................................59
6.8.1
6.8.2
CAN switching specifications................................59
DSPI switching specifications (limited voltage
range)....................................................................60
DSPI switching specifications (full voltage range).61
Inter-Integrated Circuit Interface (I2C) timing........63
UART switching specifications..............................64
SDHC specifications.............................................64
I2S/SAI switching specifications............................65
6.9 Human-machine interfaces (HMI)......................................72
6.9.1
TSI electrical specifications...................................72
7 Dimensions...............................................................................73
7.1 Obtaining package dimensions.........................................73
8 Pinout........................................................................................73
8.1 Pins with active pull control after reset..............................73
8.2 K10 Signal Multiplexing and Pin Assignments..................74
8.3 K61 Signal Multiplexing and Pin Assignments..................80
8.4 K10 pinouts.......................................................................86
5.3 Switching specifications.....................................................21
5.3.1
5.3.2
Device clock specifications...................................21
General switching specifications...........................21
5.4 Thermal specifications.......................................................23
5.4.1
5.4.2
Thermal operating requirements...........................23
Thermal attributes.................................................23
K10 Sub-Family, Rev5, 10/2013.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: PK10 and MK10
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
FFF
Qualification status
Kinetis family
Key attribute
Flash memory type
Program flash memory size
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K10
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
• 512 = 512 KB
• 1M0 = 1 MB
Table continues on the next page...
K10 Sub-Family, Rev5, 10/2013.
Freescale Semiconductor, Inc.
5
Embedded System
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