EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342E12W6B26C-W

Description
Fixed Resistor, Thin Film, 0.1W, 6260ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0603, CHIP
CategoryPassive components    The resistor   
File Size107KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

M55342E12W6B26C-W Overview

Fixed Resistor, Thin Film, 0.1W, 6260ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0603, CHIP

M55342E12W6B26C-W Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1916936729
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresPRECISION
structureChip
JESD-609 codee4
Manufacturer's serial numberM55342/12
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length1.58 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.81 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance6260 Ω
Resistor typeFIXED RESISTOR
seriesM55342/12-THINFILM
size code0603
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage50 V
State of the Art, Inc.
Thin Film Chip Resistor
M55342/12 RM0603
PROTECTIVE
ENCAPSULANT
PRECISION
THIN FILM
RESISTOR
99.6% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
PRETINNED
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
100
W
- 270K
W
0.1%, 1%, 2%, 5%
100 mW
50 Volts
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours (qualification)
High Temperature Exposure
CHARACTERISTICS*
H
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 H 12 B 100D R - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
TERMINATION MATERIALS:
SIZE CODE: /12 = RM0603
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
B: Solderable wraparound
A: 0.1%
W
D: 1%
W
G: 2%
W
J: 5%
W
B: 0.1% K
W
E: 1% K
W
H: 2% K
W
K: 5% K
W
C: 0.1% M
W
F: 1% M
W
T: 2% M
W
L: 5% M
W
W: Gold wire bondable
MECHANICAL
INCHES
MILLIMETERS
.092
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
1.58
0.81
0.46
0.25
0.36
0.86
(1.47 - 1.78)
(0.69 - 0.94)
(0.25 - 0.84)
(0.18 - 0.43)
(0.25 - 0.51)
(0.76 - 0.97)
.034
.030
.031
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
Application of C language in medical electronics industry
Studying hard!...
我爱楠楠 Medical Electronics
Select Power Issues
I would like to ask you, if the remote control switch in the live wire is used to control the fluorescent lamp, how to get the power? Thank you...
天空 Power technology
Question + About MSP430 MCU controller
UCSCTL3 |= SELREF_2; How to calculate this formula: 1) UCSCTL3=0x0020u; 2) UCSCTL3=0x162u|0x0020u=0x162u;...
羽翼之杨勇0102 Microcontroller MCU
Austrian Microelectronics 12-bit 8-channel 400ksps low-power ADC
Leave a commentRecommend to a friendPrintAustrian Microelectronics 12-bit 8-channel 400ksps low-power ADCOn January 24, austriamicrosystems launched the AS1530/31 series of fully differential 12-bit 8...
fighting Analogue and Mixed Signal
How is WinCE6.0 device mount point naming method used? ?
How is the WinCE6.0 device mount point naming method used? ? For example: \$device\COM23, how is it registered and used in CE6.0? For example, how is the registry written? Or what operations are requi...
yaodi_1985_84 Embedded System
STM8 executes Code in RAM
I have heard that STM8 can run Code on RAM. Is it possible that I compile a function and pack it into an array, put it on RAM when needed, and then run the code on RAM? Ihave been looking at this _fct...
gdaddma stm32/stm8

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2289  2194  825  889  1070  47  45  17  18  22 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号