EEWORLDEEWORLDEEWORLD

Part Number

Search

500SC04T126MRJC-ROHS

Description
Ceramic Capacitor, Ceramic,
CategoryPassive components    capacitor   
File Size2MB,22 Pages
ManufacturerEXXELIA Group
Download Datasheet Parametric View All

500SC04T126MRJC-ROHS Overview

Ceramic Capacitor, Ceramic,

500SC04T126MRJC-ROHS Parametric

Parameter NameAttribute value
Objectid7212218223
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
Number of terminals2
CERAMIC CAPACITORS
High Capacitance Stacked Capacitors
General characteristics
SC / SV Series
FEATURES
• Multilayer stacked ceramic capacitors
• Dielectric type II
• Capacitance range: 47nf to 390
µF
• Voltage range: 50 V
DC
to 500 V
DC
• SV Series: 2 wires components
• SC Series: 4 wires (W4), Dual In Line (DIL) or ribbons
terminations
MARKING
Size
Marking codes
«TA» logo
Cap code + Tolerance code
Rated voltage value
Example
TA
105M
100 V
ELECTRICAL SPECIFICATIONS
Description
CECC
EIA
Exxelia Temex Code
Operating temperature range
Maximun ΔC/°C over Temperature
range without voltage applied
Ageing
Dissipation Factor (DF)
Voltage proof
Insulation Resistance
(IR) at 25°C under Ur
Insulation Resistance
(IR) at 125°C under Ur
«X» Series (type II)
2R1
X7R
X
–55°C to +125°C
± 15%
≤2.5% per decade hour
≤ 2.5%
U
R
≤ 200 V: 2.5 x U
R
U
R
> 200 V: 2.0 x U
R
100GΩ or 1000Ω.F
whichever is the less
10GΩ or 100Ω.F
whichever is the less
≤ 100pF: 1MHz / 1Vrms (no bias)
> 100pF: 1KHz / 1Vrms (no bias)
See page 68
«T» Series (type II)
2R1
X7R
T
–55°C to +125°C
± 15%
≤2.5% per decade hour
≤ 2.5%
U
R
≤ 200 V: 2.5 x U
R
U
R
> 200 V: 2.0 x U
R
100GΩ or 1000Ω.F
whichever is the less
10GΩ or 100Ω.F
whichever is the less
≤ 100pF: 1MHz / 1Vrms (no bias)
> 100pF: 1KHz / 1Vrms (no bias)
See page 68
All sizes
PACKAGING
«Blister» boxes:
For all products, special «blister» boxes are used to optimize
the protection of the parts during the carriage and the stor-
age. Depending upon the termination (with or without con-
nection) and the size, the number of the parts in each box
is defined. Please, consult us for more details.
Measurement Conditions
for C and DF at 20°C
Capacitance versus applied
Voltage and Temperature
HOW TO ORDER
201
Rated
voltage
SV
Series
01
Exxelia
size code
X
Dielectric
code
105
Capacitance
K
Tolerance
R
Termination
-
Coating
-RoHS
RoHS
Compliant
500:
50 V
101:
100 V
201:
200 V
501:
500 V
SC
SV
00
(SC only)
01
02
03
04
05
06
07
10
(SC only)
11
(SC only)
12
(SC only)
18
(SC only)
X
= X7R
T
= X7R
1
st
two digits represent
significant figures; last
digit specifies the num-
ber of zeros to follow.
Examples:
104:
0.1µF
335:
3.3µF
156:
15µF
107:
10µF
K
= ±10%
M
= ±20%
DN
DJ
DL
DIL N type
DIL J type
DIL L type
SC Series
RoHS
= 100% tinned phosphor bronze, non magnetic.
Lead status:
0% Pb.
Non RoHS
= Sn (60%) Pb (40%) plated phosphor bronze,
non magnetic.
Lead status:
Pb 40% of the plated layer.
RoHS
= 100% tinned copper, non magnetic.
Lead status:
0% Pb
RoHS
= 100% tinned copper, non magnetic.
Lead status:
0% Pb.
W4
Radial 4 wires
Non RoHS
= Sn (70%) Pb (30%) plated Copper,
non magnetic.
Lead status:
Pb 30% of the plated layer.
SV Series
W2
Radial 2 wires
See
W4
- =
uncoated and no
marking
U =
uncoated and
marked
C =
coated and
marked
-
= non-RoHS compliant
Both RoHS and non-RoHS versions
exist. This is due to the wishes of
some customers who still need
non-RoHS components in their
applications. This suffix must be
required for RoHS compliancy.
RL
Ribbon L type
RJ
Ribbon J type
www.exxelia.com
87
info@exxelia.com
Page revised 02/21
HIGH CAPACITANCE
Samsung A8 U-Ken S5PC100 Preview
[img]http://blog.mcuol.com/User/Urbetter/Album/2010-4-273bc94af8-1272-4525-add9-32de368ac8c0.jpg[/img][img]http://blog.mcuol.com/User/Urbetter/Album/2010-4-279ca7b9cc-d08c-488e-aa7d-322e134a8194.jpg[/...
outwoods Embedded System
Urgent!!! How to decompress the eboot.bin file!!!
After the eboot.bin file is burned into the system, it will be compressed into the eboot.nb0 file. I now need to know which file and which function the code for this compression process is in! Does an...
xw0326 Embedded System
Some problems with nested make
[size=4] In some large projects, we will put our source files of different modules or different functions in different directories. We can write a Makefile for each directory, which is helpful to make...
Jacktang DSP and ARM Processors
Industrial control engineer group 70677754 - exchange development experience, solve engineering problems, and find cooperation opportunities. Non-professionals are not allowed to join.
Industrial control design group——70677754, only experts are allowed to join. Please indicate your level and direction. This group aims to exchange development experience, solve engineering problems, a...
yang_0799 Embedded System
Doesn't the EK140P have an EIM interface?
[color=#000080]A: We are using the EK140P core board, which is connected to the FPGA through the EIM interface of imx6. A dual-port RAM is built inside the FPGA. [/color] [color=#000080]It is a bit di...
明远智睿Lan Integrated technical exchanges
1602 display subfunction organized by myself
[postbg]bg8.png[/postbg]#include"1602.h" #include"delay.h" /********************************************** Function name: write_dat( uchar dat , uchar order ) Function parameters: uchar dat , uchar or...
狼牙小帅 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 683  1116  1422  455  1485  14  23  29  10  30 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号