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WEDPN16M64V-133B3M

Description
Synchronous DRAM, 16MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219
Categorystorage    storage   
File Size901KB,13 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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WEDPN16M64V-133B3M Overview

Synchronous DRAM, 16MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219

WEDPN16M64V-133B3M Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionBGA,
Reach Compliance Codecompli
access modeFOUR BANK PAGE BURST
Maximum access time5.5 ns
Other featuresAUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 codeS-PBGA-B219
length21.1 mm
memory density1073741824 bi
Memory IC TypeSYNCHRONOUS DRAM
memory width64
Number of functions1
Number of ports1
Number of terminals219
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16MX64
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Maximum seat height2.64 mm
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width21.1 mm
Base Number Matches1
WEDPN16M64V-XB3X
128MB – 16Mx64 Synchronous DRAM
FEATURES

High Frequency = 100, 125, 133MHz

Package:
• 219 Plastic Ball Grid Array (PBGA), 21 x 21mm

Single 3.3V power supply

Fully Synchronous; all signals registered on positive edge
of system clock cycle

Internal pipelined operation; column address can be
changed every clock cycle

Internal banks for hiding row access/precharge

Programmable Burst length 1,2,4,8 or full page

8,192 refresh cycles

Commercial, Industrial and Military Temperature Ranges

Organized as 16M x 64
• User configurable as 2 x 16M x 32 and 4 x 16M x 16

Weight: WEDPN16M64V-XB3X - 2.0 grams typical
GENERAL DESCRIPTION
The 128MByte (1Gb) SDRAM is a high-speed CMOS, dynamic
random-access, memory using 4 chips containing 268,435,456
bits. Each chip is internally con
gured as a quad-bank DRAM with
a synchronous interface. Each of the chip’s 67,108,864-bit banks
is organized as 8,192 rows by 512 columns by 16 bits.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for a programmed
number of locations in a programmed sequence. Accesses begin
with the registration of an ACTIVE command, which is then followed
by a READ or WRITE command. The address bits registered
coincident with the ACTIVE command are used to select the bank
and row to be accessed (BA0, BA1 select the bank; A0-12 select
the row). The address bits registered coincident with the READ or
WRITE command are used to select the starting column location
for the burst access.
The SDRAM provides for programmable READ or WRITE burst
lengths of 1, 2, 4 or 8 locations, or the full page, with a burst
terminate option. An AUTO PRECHARGE function may be enabled
to provide a self-timed row precharge that is initiated at the end
of the burst sequence.
The 1Gb SDRAM uses an internal pipelined architecture to achieve
high-speed operation. This architecture is compatible with the 2n
rule of prefetch architectures, but it also allows the column address
to be changed on every clock cycle to achieve a high-speed, fully
random access. Precharging one bank while accessing one of
the other three banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
The 1Gb SDRAM is designed to operate in 3.3V, low-power
memory systems. An auto refresh mode is provided, along with a
power-saving, power-down mode.
All inputs and outputs are LVTTL compatible. SDRAMs offer
substantial advances in DRAM operating performance, including
the ability to synchronously burst data at a high data rate with
automatic column-address generation, the ability to interleave
between internal banks in order to hide precharge time and the
continued on page 4
BENEFITS

58% SPACE SAVINGS

Reduced part count

Reduced trace lengths for lower parasitic capacitance

Suitable for hi-reliability applications

Laminate interposer for optimum TCE match

Upgradeable to 32M x 64 density (W332M64V-XBX)
* This product is subject to change without notice.
DENSITY COMPARISONS
Discrete Approach (mm)
11.9
11.9
11.9
11.9
WEDPN16M64V-XB3X
21
22.3
WEDPN16M64V-XB3X
21
S
A
V
I
N
G
S
58%
Area
4 x 265mm
2
= 1,060mm
2
441mm
2
Microsemi Corporation reserves the right to change products or specifications without notice.
December 2015
Rev. 1
© 2015 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp

WEDPN16M64V-133B3M Related Products

WEDPN16M64V-133B3M WEDPN16M64V-133B3I WEDPN16M64V-133B3C
Description Synchronous DRAM, 16MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219 Synchronous DRAM, 16MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219 Synchronous DRAM, 16MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219
Maker Microsemi Microsemi Microsemi
package instruction BGA, BGA, BGA,
Reach Compliance Code compli compli compli
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 5.5 ns 5.5 ns 5.5 ns
Other features AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 code S-PBGA-B219 S-PBGA-B219 S-PBGA-B219
length 21.1 mm 21.1 mm 21.1 mm
memory density 1073741824 bi 1073741824 bi 1073741824 bi
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 64 64 64
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 219 219 219
word count 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 70 °C
Minimum operating temperature -55 °C -40 °C -
organize 16MX64 16MX64 16MX64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Maximum seat height 2.64 mm 2.64 mm 2.64 mm
self refresh YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL COMMERCIAL
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 21.1 mm 21.1 mm 21.1 mm
Base Number Matches 1 1 1

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