THICK FILM
SMD
hVc Series
Precision High-Value High-voltage Wraparound Chip
• High value chip resistors in thick film technology
• Low temperature and voltage dependency (low TCR and VCR)
• High working voltage up to 3000V
• Suitable for high vacuum applications—no organics
• Contact areas: Nickel-barrier/matte tin
• Wraparound terminals
S e r i e S S p e c i f i c at i o n S
HIGH
VOLTAGE
f e at u r e S
Series
HVC0805---
Type
0805
Wattage
1
P
70
(mW)
125
HVC1206---
1206
250
HVC2512---
2512
1000
Oper. Voltage (V)
Resistance
std. untrimmed (≥5%)
Range
200
600
100K-100M
>100M-1G
>1G-10G
>10G-100G
600
1000
100K-100M
>100M-1G
>1G-10G
>10G-100G
2000
3000
100K-100M
>100M-1G
>1G-10G
>10G-100G
Tolerance
0.5-10%
2-20%
5-20%
10-30%
0.5-10%
2-20%
5-20%
10-30%
0.5-10%
1-20%
2-20%
5-30%
TCR
2
(ppm)
25, 50, 100
50, 100, 250
100, 250
1000, 2000
25, 50, 100
50, 100, 250
100, 250
500, 1000
25, 50, 100
25, 50, 100
50, 100
250, 500
VCR
2
(ppm)
50
250
500
1000
50
100
250
1000
10
25
100
250
1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction.
2. Not all TCR/VCR combinations available in all resistance values
characteriSticS
Operating temperature
-55°C ~ +155°C
range
Climatic category
55/155/56, acc. to EN 60068-1
Solderability
250°C, 3s, acc. to EN 60068-2-58
Max. soldering temperature
260°C, 10s, acc. to IEC 68-2-58
Long Term Stability
<1G
Load Life 70°C/1000h <0.25%
Storage 125°C/1000h <0.5%
Max. Voltage/1000h
<0.5%
<10G
<0.5%
<1%
<1%
≥1G
<1%
<2%
<2%
Derating
100
Percent Rated Power
80
60
40
20
0
-55
0
50 70 100
Ambient Temperature,
°C
155
Data not specified according to EN 140401-802 (CECC 40401-802)
t e r m i n a l D e ta i l S
Base Metal
PtAg
Termination Finish
100% electroplated matte Sn100
Thickness of Finish
5 microns
Barrier Material between Base Metal and Finish
Porosity-free Ni (5-8 microns thickness)
Baking/Annealing Process after Sn Plating
150°C; > 4 hours
Peak Process Body Temperature (Classification
260°C for 10 seconds
Temperature) and Maximum Time
1
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Embedded System
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